The Equipment Demonstration program of the IRPS focuses on providing attendees with an opportunity to learn about reliability software and equipment in a confidential, "hands-on" fashion. Unlike typical trade events, sales pressures are minimized, and manufacturers are prepared to help attendees learn about, and test their latest equipment and software developments. Attendees are strongly encouraged to contact the demonstrators prior to the conference, and to make arrangements to bring their own samples, if desired. The following abstracts provide an overview of the nature of each company's demonstration, along with contact information. The www.irps.org web site will contain the latest information as more demonstrators are added to the program.
Demonstrators and other companies providing a variety of reliability physics products and services are also represented in the coffee break area. There, they will provide information on their products and sign-up sheets for demonstrations. You can sign-up for demonstrations at any time during the conference. This service is included in your registration and you can sign-up for as many demonstrations as you like, on a first-come, first-serve basis. So there is really no better way to evaluate so many state-of-the-art systems, and to collect so much information on services, latest equipment, and software developments …than to participate in IRPS Demos!
The coffee break area is located adjacent to the Technical Program and the demonstration area is in Parkside Exhibit Hall across Plaza de Cesar Chavez from the hotel. Hours for equipment demonstrations are as follows:
Demo#1: COPPER AND ALUMINUM RELIABILITY TEST SYSTEMS FOR PACKAGE LEVEL AND CONVENTIONAL WAFER LEVEL TESTING—Aetruim Inc.
Demo#2:COMPLETE PREDICTIVE WAFER LEVEL RELIABILITY SOLUTIONS—Agilent Technologies (A subsidiary of HP)
Demo#3:PORTABLE EMISSION MICROSCOPE—Alpha Innotech,
Demo#4:ESD TEST EQUIPMENT—Barth Electronics
Demo#5:OXIDE AND HOT CARRIER TESTING AND SIMULATION—BTA Technology, Inc.
Demo#6:AUTOMATIC & SEMI-AUTOMATIC PROBERS—Cascade Microtech
Demo#7:PACKAGE LEVEL RELIABILITY TEST SOLUTIONS—Cottonwood Technology Group, Inc.
Demo#8:TEST SYSTEMS THAT PERFORM HIGH RESOLUTION IN-SITU MEASUREMENTS—Destin
Demo#9:BEST RANGE APPLICATIONS FOR SERIOUS INVESTIGATORS OF RELIABILITY PHYSICS—Digital Instruments, Veeco Metrology Group
Demo#10:SEMICONDUCTOR FAILURE ANALYSIS SYSTEM—Hamamatsu Photonic Systems
Demo#11:BACKSIDE EMISSION MICROSCOPY: CHIP UNZIP BACKSIDE WAFER PREPARATION SYSTEM—Hypervision Inc.
Demo#12:EMISSION and ATOMIC FORCE MICROSCOPY, 300 mm WAFERS, LOW NOISE TESTING—Karl Suss America, Inc.
Demo#13:FAILURE MECHANISM MODELING TESTS ON WAFERS_Keithley Instruments
Demo#14:AUTOMATIC ESD AND LATCHUP TESTERS—KeyTek,
Demo#15:FULL SCALE SCHEMATIC TOOLS PACKAGE FOR FA—Knights Technology
Demo#16:DATA ANALYSIS TOOLS AND PROCESS EVALUATION TEST SYSTEMS—Micro Instrument Co.
Demo#17:VERSATILE EOS/ESD SUSCEPTIBILITY TEST INSTRUMENTS—Oryx Instruments
Demo#18:TURN-KEY SEMICONDUCTOR RELIABILITY TEST—QualiTau
Demo#19:SAGITTA NEXT-1 EXACT X-SECTIONING TOOL—Sagitta. LTD
Demo#20:WAVEFORM MEASUREMENT RESULTS OBTAINED ON AN OPTICAL PROBING SYSTEM—Schlumberger Test & Transactions
Demo#21:SCANNING ACOUSTIC MICROSCOPY WITH HIGH RESOLUTION—Sonix Inc.
Demo#22:NEW VISUAL ACOUSTICS™ OPERATING SOFTWARE BASED ON TRUE WINDOWS NT OPERATING SYSTEM—Sonoscan, Inc.
Demo#23:LOW NOISE, LOW CURRENT ANALYTICAL PROBING—The Micromanipulator Co.
Demo#24:ELECTRICAL CHARACTERIZATION OF INTEGRATED CIRCUITS FOR FAILURE ANALYSIS—UltraTest International
DEMONSTRATORS ABSTRACTS(as of January 24)
Demo #1: Copper and Aluminum reliability test systems for Package Level and Conventional Wafer Level Testing—Aetruim Inc.
Our revolutionary Model 1164 Reliability Test System has a massively parallel architecture that allows you to run many tests at many temperatures simultaneously. You can configure each system for any mix of Copper and Aluminum Electromigration and TDDB, MOS Hot Carrier, plus a NEW capability to test high power devices addressing RF Life-test applications. NEW custom-designed DUT fixtures and ovens test above 350°C without corrosion or contact relaxation for long term measurement reliability. Modularity improves throughput, eliminates scanning, and maintains high performance, flexibility, and low cost. Full-featured software easily provides powerful analysis for lifetime predictions.
Demo #2:COMPLETE PREDICTIVE WAFER LEVEL RELIABILITY SOLUTIONS—Agilent Technologies (A subsidiary of HP)
Agilent's fast PDQ-WLR solution is the choice for more and more companies to develop, qualify and monitor their process reliability. For example, customers have reduced COPPER and LOW-K development tests from two months to two days—all while maintaining agreement with traditional tests. As part of a complete solution, revolutionary integrated analysis makes sure you spend even less time getting the answers you need. Agilent also introduces a new multi-site wafer level hot carrier stressing system based on the 4156B Semiconductor Parameter Analyzer. Features include simple front panel control and innovative prober card cabling for fA level measurement integrity.
Demo #3: PORTABLE EMISSION MICROSCOPE—Alpha Innotech
Alpha Innotech will demonstrate our Portable Emission Microscope, which easily interfaces to probestation, testhead, and overhead wafer sort, including our patented VibeCoupler TM for elimination of 100x image jitter. Attendees can perform hands-on imaging of their samples. Portable Emission Microscopy brings the photoemission tool to the problem, accelerating root cause determination.
Demo #4: ESD TEST EQUIPMENT—Barth Electronics
The Barth Model 4002 TLP electrical inspection tool for ESD protection structures will be available to measure the complete I/V characteristics on your wafer or packaged part. This test method allows a silicon circuit designer to measure the electrical characteristics curve with the first commercial TLP Pulse Curve Tracer. Bring your ESD protection structure for testing and get an insight into its electrical operation, or see how closely it matches its planned protection objective.
Demo #5: OXIDE AND HOT CARRIER TESTING AND SIMULATION—BTA Technology, Inc.
BTA Technology will demonstrate 1) hot carrier analysis software suite, BTABERT, RelPro+ and BSIMPro, which can help design and reliability engineers analyze hot carrier impact on circuit performance and push for design performance and 2) TDDB and Burn-In simulation software, TDDBWorks. We will also demonstrate BTA9812A and NoisePro, automatic wafer level 1/f noise characterization system with hot carrier stress and TDDB testing function, which can quantify hot carrier and TDDB impact on 1/f noise characteristics of devices automatically.
Demo #6: AUTOMATIC & SEMI-AUTOMATIC PROBERS—Cascade Microtech
Cascade Microtech will demonstrate their PS21 parametric autoprober with eight inch capacity, 25 wafer cassette, femtoAmp level 48-pin probe card interface, & -55 to 200 °C guarded thermal chuck with <5 picoFarad capacitance. In addition, the Summit series semi-automatic analytical probe stations offer fast transition, -65 to 300 degree thermal chucks optimized for all WLR disciplines. Included in the series is the Summit 12861 for DC/CV characterization featuring the patented AttoGuard™ thermal system with < 1 picoFarad chuck capacitance, 3 femtoFarad chuck variation, < 20 femtoAmp noise & leakage, & 50 milliSecond recovery time from a 100 Volt pulse.
Demo #7: PACKAGE LEVEL RELIABILITY TEST SOLUTIONS—Cottonwood Technology Group, Inc.
Cottonwood Technology Group offers package level reliability solutions for: (1) Power Cycle Testing, (2) Temperature and Humidity Testing, (3) In-situational Thermal Stress Testing. We will show how our solutions help quality and reliability engineers achieve greater effectiveness in their work by: (1) Decreasing test set up time from days to hours, (2) Reducing problem isolation time from weeks to hours, (3) Employing closed loop control to provide extremely accurate stresses, (4) Allowing trend data analysis while the stress is running. Metrics Technology will also be present to discuss their new WLR solutions as well as the joint application developed with Cottonwood to perform I-V and C-V measurements and analysis for design verification, process troubleshooting, reliability engineering and failure analysis.
Demo#8: TEST SYSTEMS THAT PERFORM HIGH RESOLUTION IN-SITU MEASUREMENTS—Destin
Destin test systems perform high resolution in-situ measurements to monitor the degradation of test samples. This technique allows the performance of reliability tests in short test times (typically a few days to a week) at low stresses. This will be demonstrated for both electromigration and thermal degradation of packages. The software package "Failure" is a powerful tool to analyze reliability data. This program allows the prediction of lifetime and calculates the uncertainty of the prediction. The IDDQ failure analysis test system is a helpful tool to locate failures with the aid of liquid crystals or emission microscopes.
Demo #9: BEST RANGE APPLICATIONS FOR SERIOUS INVESTIGATORS OF RELIABILITY PHYSICS—Digital Instruments
Digital Instruments will demonstrate the Dimension 3100 scanning probe microscope (SPM) system. The applications include electrical applications modules for: Scanning Capacitance Microscopy (SCM) allowing the user unprecedented imaging resolution of electron device structure & operation through 2 & 3D dopant metrology. Scanning Spreading Resistance Microscopy (SSRM) permits high sensitivity nanometer resolution of resistivity in semiconductors. Tunneling AFM (TUNA) gives a 2D map of gate oxide thickness & integrity for dielectric characterization Each of these & other techniques such as Scanning Thermal Microscopy (SThM) & Electric force Microscopy (EFM) provide unique material & device property characterization & failure analysis on a nanometer scale, without requiring vacuum & in a manner that is non-destructive to the samples. You are encouraged to bring samples to image.
Demo #10: SEMICONDUCTOR FAILURE ANALYSIS SYSTEM—Hamamatsu Photonic Systems
Hamamatsu will demonstrate the µAmos-200. The µAmos is a semiconductor failure analyzer that utilizes a revolutionary new IR-OBIRCH (InfaRed Optical Beam Induced Resistance Change) method for localization of leakage current path. µAmos also observes the abnormal resistance of contacts (via contacts) in LSI devices. Hamamatsu will also introduce the PHEMOS-1000 an IR Confocal Laser Scanning Emission Microscopy system.
Demo #11: BACKSIDE EMISSION MICROSCOPY: CHIP UNZIP BACKSIDE WAFER PREPARATION SYSTEM—Hypervision Inc.
The patented Chip UnZip™ hardware process safely thins semiconductor die for backside inspection of wafers and packages. It allows the BEAMS emission microscope to inspect devices and wafers from the backside. The proprietary SmartCam™ 3-D software interface program automatically creates code to control both the CAD software and the CNC mill.
Demo #12: EMISSION and ATOMIC FORCE MICROSCOPY, 300 mm WAFERS, LOW NOISE TESTING—Karl Suss America, Inc.
Karl Suss will be exhibiting the world's first Real-Time Probe which can see and test devices below 0.25 microns. Karl Suss and Micron Force Instruments have partnered to develop a Real-Time, contact probe that utilizes the unique advantages of Atomic Force Microscopy (AFM). In addition, the SUSS display will include new, innovative probing solutions relating to emission microscopy, low current/low noise temperature testing, and 300 mm applications. The SUSS Probeshield system overcomes issues relating to mechanical infringements with microscope and probe arm movements, as well as, providing a true, frost free environment.
Demo #13: FAILURE MECHANISM MODELING TESTS ON WAFERS_Keithley Instruments
Keithley Instruments will demonstrate equipment for the performance of Failure Mechanism Modeling tests on Wafers and for Fast Process Reliability Monitoring. The equipment showcases advanced low current measurement capability (10-17 Amps) and a complete system including instruments, prober and advanced multisite probe card.
Demo #14: AUTOMATIC ESD AND LATCHUP TESTERS—KeyTek
KeyTek will demonstrate two testers: (1) PARAGON, an advanced ESD and latch-up test system for testing from 256 to 1024 pin systems (2) RCDM, a Robotic CDM ESD test system. Attendees may also operate the equipment themselves, and time permitting, to perform ESD tests on one or two of their own devices. (Prior arrangements should be made to ensure appropriate DUT boards are available.)
Demo #15: FULL SCALE SCHEMATIC TOOLS PACKAGE FOR FA—Knights Technology
Merlin's Framework, the industry standard CAD Nav software product will be shown with it's new features, branches, and versions. Among them, a package of full-scale schematic tools is ready for failure analysis. KEDIT and Image Overlay options are helping FA engineers. PC version of Merlin software is available now. FA Wizard is the on-line documentation for all level of FA people, and its' Web version is available now. LogicMap is the new Fault Localization tool for the logic designs. After all above, a new generation of Merlin, Merlin 2000, is ready to demonstrate its' architectures.
Demo #16: DATA ANALYSIS TOOLS AND PROCESS EVALUATION TEST SYSTEMS—Micro Instrument Co.
Micro Instrument Company will provide a hands-on demonstration of new testing capabilities in our (NEW) SPC4000 test system for electromigration and TDDB. Our (NEW) CH4000 chamber has capability for both aluminum and copper testing with temperatures in the 70 °C to 450 °C Range. Coupled with our new high resolution Instrumentation for Electromigration and TDDB the system provides an ideal test platform. New test software allows our existing and new instrumentation to operate within the same environment. Multi-Lead capability of our new DM610 instrumentation can perform TDDB, and some Hot Carrier tests. See our upgraded PE9010A for Hot Carrier testing and a PE9020A for small lot, multiple temperature, testing to 350 °C.
Demo #17: VERSATILE EOS/ESD SUSCEPTIBILITY TEST INSTRUMENTS—Oryx Instruments
Oryx Instruments offers the most comprehensive, affordable line of ESD Test Systems and Latch-Up. Capabilities include: Manual and Automated systems, pin counts from 64 to 2016, package and wafer level test support, ESD - Human Body model, Machine Model, ESD - Charged Device Model, Transmission Line Pulsing, JEDEC 78 Latch-Up, Transient Latch-Up.
Demo #18: TURN-KEY SEMICONDUCTOR RELIABILITY TEST—QualiTau
QualiTau will exhibit various turn-key semiconductor reliability test solutions for performing electromigration, dielectric breakdown, & hot carrier degradation testing for package & wafer level, featuring various plug-in modules & complete analysis software. Featured systems are the MIRA, INFINITY, ACE & a multiple die probing system. In addition to the various test applications available on the MIRA, also featured will be the latest design of our High temperature DUT boards & our new 450 °C oven system & a current source for every DUT. The state-of_the-art INFINITY system features capability for package level & wafer level TDDB testing with an independent SMU for each DUT.
Demo #19: SAGITTA NEXT-1 EXACT X-SECTIONING TOOL—Sagitta. LTD
Sagitta has introduced a new concept of automating sample preparation for SEM & TEM analysis using polishing technology, advanced image processing, and process control. This allows sample preparation with high success rates and accuracy regardless of operator experience. The advanced control and machine vision enables to 0.1 micron accuracy at higher than 90% success rates with an unattended process. The latest software developments allow SEM and TEM sample preparation on the same system with greater ease of use. Attendees will have hands-on involvement in the preparation of their samples. Sagitta encourages customers to bring their own samples for precise cross-sectioning.
Demo #20: WAVEFORM MEASUREMENT RESULTS OBTAINED ON AN OPTICAL PROBING SYSTEM—Schlumberger Test & Transactions
An innovative technology incorporating a laser beam has recently been developed by Schlumberger that probes through silicon and detects voltage swings directly on the active regions of transistors in CMOS ICs. Schlumberger will present waveform measurement results, user interface and system technology and hardware overview. Analog and Mixed Signal device products are developed faster with the new Schlumberger Analog Measurement System (AMS). Not only does the AMS provide multiple FIB chemistries for probepoint but also provides <10 mm resolution for precision probe placement in the dense geometries of 0.18 micron process technologies.
Demo #21: SCANNING ACOUSTIC MICROSCOPY WITH HIGH RESOLUTION—Sonix Inc.
Sonix will demonstrate the state of the art in Scanning Acoustic Microscopy _the UHR2000 Ultra High Resolution SAM with advanced TAMI imaging capability and the ICEBERG offline analysis package. TAMI allows the operator to generate multiple focused C-scan images (slices) of the sample in one scan. ICEBERG offers unparalleled analysis capabilities since all the RF data is stored. Unlimited A-, B- and C- scans can then be generated off line. C-scans can also be generated from frequency domain information (FFTs) rather than the time domain. Attendees (up to four per hour) are invited to bring their IC packages and see them in a different light.
Demo #22: NEW VISUAL ACOUSTICS™ OPERATING SOFTWARE BASED ON TRUE WINDOWS NT OPERATING SYSTEM—Sonoscan, Inc.
Sonoscan's new D9000 and D24 series of digital C-SAM ® Acoustic Microscopes features faster and more accurate scanning and are equipped with pulse/receivers having 500 MHz bandwidth. Sonoscan also offers a complete family of 230 MHz transducers (currently 6 different designs) optimized for a variety of applications including the inspection of flip chips. The D9000 & D24 feature Very High-Res™ scanning, which produces images with up to 8192 x 7680 data points. Sonoscan's new Visual Acoustics™ operating software, based on a true Windows® NT operating system, is extremely simple and intuitive to use. New features within Visual Acoustics Operating Software include Zip Slice™, 3V™, & C-SAM Interactive™.
Demo #23: LOW NOISE, LOW CURRENT ANALYTICAL PROBING—The Micromanipulator Co.
Probe at resolutions up to 0.05 microns using Micromanipulator's 8860 semi-automatic analytical test stations. Learn how to probe at very low femtoamp levels (less than 10 fA range) & at elevated temperature using triaxial probes, triaxial chucks, integrated shielding and unique high-stability probes. Discussions & examples of incorrect test setups & common errors that can introduce unwanted leakage, electrical and/or physical noise into probing measurements, and practical solutions to these problems will be presented.
Demo #24: ELECTRICAL CHARACTERIZATION OF INTEGRATED CIRCUITS FOR FAILURE ANALYSIS—UltraTest International
UltraTest will demonstrate their new MegaTrace DC Parametric Test System and Automated Digital Curve Tracer. The system is capable of testing devices up to 2,160 pins. Basic curve trace concepts, techniques and interpretation of waveform results will be discussed. Also demonstrated will be the system's capability to perform DC parametric testing, logical pre-conditioning, CMOS Latch-up testing with up to 50A capability and new "curve compare" software. UTI will introduce several new software features and significant improvements in the system's "vectoring" capability, including IDDQ.
ADDITIONAL COFFEE BREAK SPONSORS
| •Accurel Systems | •LEO Electron Microscopy, Inc. |
| •B&G Enterprises | •Micro Control Company |
| •Celadon Systems, Inc. | •Reedholm |
| •Cody Electronics | •SELA-USA,Inc. |
| •CR Technology | •Sandia National Laboratories |
| •FEI Company | •TPEC |
| •IBM Analytical Services | •Viko Test Lab _ ADEC |