Technical Program Committee



	TECHNICAL PROGRAM COMMITTEE W.R. Tonti, Chair IBM MicroElectronics Essex Junction, VT

	*Assembly and Packaging* T.M. Moore, Chair Texas Instruments Dallas, TX S. Sidharth, Vice Chair AMD Sunnyvale, CA J.M. Anthony University of South Florida Tampa, FL P.F. Bechtold Lucent Technologies Allentown, PA R.C. Blish AMD Sunnyvale, CA J. Ewanich Toshiba America San Jose, CA C. Grosskopf IBM Hopewell Junction, NY J.T. McCullen Intel Chandler, AZ *Compound Semiconductors & Opto* F. Fantini, Chair University of Modena Modena, Italy J.J. Liou, Vice Chair Univ. of Central Florida Orlando, FL M. Dammann FHG IAF Freiburg, Germany M. Fukuda NTT Electronics Corp. Kanagawa, Japan T. Henderson Texas Instruments Dallas, TX C. Huang Air Force Research Lab. Wright-Patterson AFB, OH



	A. Touboul University of Bordeaux Talence, France C. Wai Kin National Univ. of Singapore Singapore, Singapore R.N. Wallace Sanders Nashua, NH *Device & Process* E.A. Amerasekera, Chair Texas Instruments Dallas, TX K.F. Schuegraf, Vice Chair Conexant Systems Newport Beach, CA J.M. Hicks Intel Santa Clara, CA K. Kubota Hitachi Tokyo, Japan F.G. Kuper Philips Semiconductors Nijmegen, The Netherlands B.-K. Liew TSMC R&D Hsinchu, Taiwan N.E. Lycoudes Motorola Tempe, AZ M. Rowlandson Lattice Semiconductor Hillsboro, OR J.M. Soden Sandia National Labs Albuquerque, NM K. Takeuchi NEC Corp. Sagamihara, Japan *Device Dielectrics* E. Rosenbaum, Chair Univ. of IL Urbana, IL E. Wu, Vice Chair IBM Essex Junction, VT R. Degraeve IMEC Leuven, Belgium A.B. Joshi Conexant Systems Newport Beach, CA



	B.T. Moore Samsung Austin, TX J. Sune Univ. Autonoma de Barcelona Bellaterra, Spain S. Takagi Toshiba Yokohama, Japan R.P. Vollertsen Infineon Technologies Essex Junction, VT B.E. Weir Lucent Technologies Murray Hill, NJ *ESD and Latch-up* C. Duvvury, Chair Texas Instruments Dallas, TX R.J. Gauthier, Vice Chair IBM Essex Junction, VT W. Anderson Compaq Shrewsbury, MA K. Bock Fraunhofer Mgmt. Gesellschaft Munich, Germany T.J. Maloney Intel Corp Santa Clara, CA J. Smith Motorola Austin, TX W. Stadler Infineon Munich, Germany *Failure Analysis* D.L. Barton, Chair Sandia National Labs Albuquerque, NM J.C.H. Phang, Vice Chair National Univ. of Singapore Singapore K. Bernhard-Hoefer Infineon Technologies Munich, Germany K. Nikawa NEC Corporation Kawasaki, Japan D.P. Vallett IBM Essex Junction, VT



	L.C. Wagner Texas Instruments Dallas, TX *Hot Carriers* R.C. Lacoe, Chair The Aerospace Corp. Los Angeles, CA G. La Rosa, Vice Chair IBM MicroElectronics Hopewell Junction, NY Y.M. Haddara Cypress Semiconductor San Jose, CA H. Hwang KJIST Kwangju, Korea D.E. Ioannou George Mason University Fairfax, VA R. Katsumata Toshiba E.E. King The Aerospace Corp. Los Angeles, CA Z. Liu BTA Technology San Jose, CA M. Song Conexant Systems, Inc. Newport Beach, CA R. Thewes Infineon Technologies Munich, Germany J. Wang-Ratkovic AMD Sunnyvale, CA M.R. Wordeman IBM Microelectronics Hopewell Jct., VT *Interconnect* J.J. Clement, Chair Sandia National Labs Albuquerque, NM J.R. Lloyd, Vice Chair JPL Pasadena, CA L. Arnaud LETI-CEA Grenoble, France T.N.D. Marieb Intel Hillsboro, OR



	A. Preussger Infineon München, Germany K.P. Rodbell IBM, TJ Watson Yorktown Heights, NY H.A. Schafft NIST Silver Spring, MD J.A. Walls Motorola Mesa, AZ *MEMS* W.M. Miller Sandia National Labs Albuquerque, NM S.A. Kayali JPL Pasadena, CA S. Arney Lucent Technologies Murray Hill, NJ P.J. Boudreaux Lab for Physical Sciences Lanham, MD M.R. Douglass Texas Instruments Plano, TX G. Johnson University of California Berkeley, CA A. Witvrouw IMEC Leuven, Belgium *Process Induced Damage* T.B. Hook, Chair IBM Essex Junction, VT P.E. Nicollian, Vice Chair Texas Instruments Dallas, TX B.L. Bhuva Vanderbilt University Nashville, TN N.D. Bui Vantis Sunnyvale, CA C. Gabriel VLSI Technology San Jose, CA S. Krishnan Texas Instruments Dallas, TX



	J.P. McVittie Stanford University Stanford, CA