Chung-Yang Tsao received the B.S. (1993) and M.S. (1995) in electrical engineering from National Cheng Kung University, Taiwan. Joined TSMC 1997, in product engineering, responsible for yield analysis, improvement, failure analysis and customer technical assistance. 1999 until now, job transferring to product reliability assurance section. He has a U.S. patent and has published a technical paper related with SiGex in photo detector OEIC application.