Changsup Ryu received the B.S. (1987) and M.S. (1989) in metallurgical engineering from Seoul National University, Seoul, Korea, and the Ph.D. (1998) in material science and engineering from Stanford University, Stanford, CA. His doctoral work focused on the microstructure and the electromigration reliability of copper interconnects. In 1998, he joined Motorola Semiconductor Product Sector, Chandler, AZ, where he is a Senior Reliability Engineer. He is currently working on metal reliability issues including electromigration and stressmigration of various interconnect technologies.