Dr. Ennis Ogawa is currently a Research Associate at the Lab for Interconnect and Packaging at J. J. Pickle Research Campus of The University of TX at Austin, under the direction Prof. Paul S. Ho. Prior to that, he received a B.S. in physics from Stanford University and Ph.D. in physics at The University of TX at Austin. His current research has been focused in the area of interconnect reliability in dual-damascene Cu systems but also includes work in the general area of thin films and interfaces. He is also beginning to learn the art and science of fatherhood.