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VIRTUAL SYMPOSIUM |
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| C O N T E N T S |
| Keynote Address |
Dr. Bernard Meyerson's Keynote Address
pdf of visuals & Questions & Answers
Non Volatile Memory - Session 1
ESREF Invited Paper (Dielectrics Topic)
DIELECTRICS I - Session 2A
HOT CARRIERS - Session 2B
MEMS - Session 2C
ASSEMBLY/PACKAGING - Session 2D
ESD & LATCHUP - Session 3A
COMPOUND SEMICONDUCTORS I - Session 3B
2A.1 A Thorough Investigation of Progressive Breakdown in Ultra-thin Oxides: Physical Understanding
and Application for Industrial Reliability Assessment
pdf of visuals, pdf of paper & 2A.1 Questions and Answers
2A.2 Location and Hardness of the Oxide Breakdown in Short Channel n- and p-MOSFETs
pdf of visuals, pdf of paper & 2A.2 Questions and Answers
2A.3 Polarity-Dependent Oxide Breakdown of NFET Devices for Ultra-Thin Gate Oxide
2A.4 Gate Oxide Reliability Of Drain-Side Stresses Compared To Gate Stresses
pdf of visuals, pdf of paper & 2A.4 Questions and Answers
2B.1 NBT-induced Hot Carrier (HC) Effect: Positive Feedback Mechanism in p-MOSFET’s Degradation
pdf of visuals, pdf of paper & 2B.1 Questions and Answers
2B.2 A Drain Avalanche Hot Carrier Lifetime Model for n- and p-Channel MOSFET’s
pdf of visuals, pdf of paper &2B.2 Questions and Answers
2B.3 Excess Hot-Carrier Currents in SOI MOSFETs and Its Implications
pdf of visuals, pdf of paper &2B.3 Questions and Answers
2B.4 Effects of Hot-Carrier Stress on the RF Performance of 0.18 µm Technology NMOSFETs and Circuits
pdf of visuals, pdf of paper &2B.4 Questions and Answers
2B.5 Hot Carrier Reliability of N-LDMOS Transistor Arrays for Power BiCMOS Applications
2C.1 Invited Paper: RF MEMS Switches and Applications
pdf of visuals, pdf of paper & 2C.1 Questions and Answers
2C.2 Invited Paper: Techniques for Reliability Analysis of MEMS RF Switch
pdf of visuals, pdf of paper & 2C.2 Questions and Answers
2C.3 Digital Micromirror Device (DMD) Hinge Memory Lifetime Reliability Modeling
pdf of visuals, pdf of paper & 2C.3 Questions and Answers
2C.4 Pin-Joint Design Effect on the Reliability of a Polysilicon Microengine
pdf of visuals, pdf of paper & 2C.4 Questions and Answers
2D.2 Invited Paper: Product-specific ‘Moisture Levels’: A Conceptual Framework
pdf of visuals, pdf of paper & 2D.2 Questions and Answers
2D.3 Invited Paper: Hermeticity and Stiction in MEMS Packaging
pdf of visuals, pdf of paper & 2D.3 Questions and Answers
2D.4 Invited Paper: Probing and Wire Bonding of Aluminum Capped Copper Pads
pdf of visuals, pdf of paper & 2D.4 Questions and Answers
3A.2 Investigation of Gate to Contact Spacing Effect on ESD Robustness of Salicided Deep Submicron Single Finger NMOS Transistors
pdf of visuals, pdf of paper & 3A.2 Questions and Answers
3A.3 Novel ESD Protection Structure with Embedded SCR LDMOS for Smart Power Technology
pdf of visuals, pdf of paper & 3A.3 Questions and Answers
3A.4 ESD Circuit Simulation for the Prevention of ESD Failures — Application to Products in a 0.18 µm CMOS Technology
pdf of visuals, pdf of paper & 3A.4 Questions and Answers
3A.5 Electrostatic Discharge Induced Oxide Breakdown Characterization in a 0.1 µm CMOS Technology
pdf of visuals, pdf of paper & 3A.5 Questions and Answers
3B.1 High Current Transmission Line Pulse (TLP) and ESD Characterization of a Silicon Germanium Heterojunction Bipolar Transistor with Carbon Incorporated
pdf of visuals, pdf of paper & 3B.1 Questions and Answers
3B.2 Wafer Level Forward Current Reliability Analysis of 120GHz Production SiGe HBTs under Accelerated Current Stress
pdf of visuals, pdf of paper & 3B.2 Questions and Answers
3B.3 Physical Mechanisms of Performance Instabilities such as Gate-Lag and Kink Phenomena in GaAs MESFETs
pdf of visuals, pdf of paper & 3B.3 Questions and Answers