FAILURE ANALYSIS - Session 3C

3C.1 Recovery of Shifted MOS Parameters Induced by Focused Ion Beam Exposure
pdf of visuals, pdf of paper & 3C.1 Questions & Answers
3C.3 Reliability of Ultra Thinning of Flip Chips for Through-Silicon Analyses
pdf of visuals, pdf of paper
3C.4 Neural Network Classification of Photoemission Spectra
pdf of visuals, pdf of paper & 3C.4 Questions & Answers
3C.5 Physical Analysis of Ti-migration in 33Å Gate Oxide Breakdown
pdf of visuals, pdf of paper & 3C.5 Questions & Answers

PRODUCT RELIABILITY I - Session 3D

3D.1 Soft Error Rate Mitigation Techniques for Modern Microcircuits
pdf of visuals, pdf of paper & 3D.1 Questions and Answers
3D.2 SER Reliability of 1TRAM Designs
pdf of visuals, pdf of paper & 3D.2 Questions and Answers

COMPOUND SEMICONDUCTOR II Session 4A

4A.1 Reliability Test of MESFETs in Presence of Hot Electrons
pdf of visuals, pdf of paper & 4A.1 Questions and Answers
4A.2 Innovative Nitride Passivation on Pseudomorphic GaAS HEMTs and Its Impact on Device Performance
pdf of visuals, pdf of paper &4A.2 Questions and Answers
4A.3 Evolution of DC and RF Degradation Induced by High-Temperature Accelerated Lifetest of Pseudomorphic GaAs and InGaAs/InAlAs/InP HEMT MMICs
pdf of visuals, pdf of paper &4A.3 Questions and Answers

DEVICE & PROCESS Session 4B

4B.1 Impact of Negative Bias Temperature Instability on Digital Circuit Reliability
pdf of visuals, pdf of paper & 4B.1 Questions and Answers
4B.2 Leakage Current and Reliability Evaluation of Ultra- thin Re- oxidized Nitride and Comparison with Silicon Dioxides
pdf of visuals, pdf of paper & 4B.2 Questions and Answers
4B.3 Extending the Reliability Scaling Limit of Gate Dielectrics through Remote Plasma Nitridation of N₂-O-Grown Oxides and NO RTA Treatment
pdf of visuals, pdf of paper & 4B.3 Questions and Answers
4B.4 N- FET HCI Reliability Improvement by Nitrogen Interstitialization and its Mechanism
pdf of visuals, pdf of paper & 4B.4 Questions and Answers
4B.5 Mechanism of Device Degradation under AC stress in Low- Temperature Polycrystalline Silicon TFTs
pdf of visuals, pdf of paper & 4B.4 Questions and Answers

PRODUCT RELIABILITY II - Session 4C

4C.1 Evaluation of STI Degradation Causing DRAM Standby Current Failure in Burn- in Mode Operation Using a Carrier Injection Method
pdf of visuals, pdf of paper & 4C.1 Questions and Answers
4C.2 Charge Trapping Induced DRAM Data Retention Time Degradation under Wafer- Level Burn- in Stress
pdf of visuals, pdf of paper & 4C.2 Questions and Answers
4C.3 A Technique to Predict Gate Oxide Reliability Using Fast On- Line Ramped QBD Testing
pdf of visuals, pdf of paper & 4C.3 Questions and Answers

INTERCONNECTS - Session 4D

4D.1 (Invited) Investigation of Via- Dominated Multi- Modal Electromigration Failure Distributions in Dual Damascene Cu Interconnects With a Discussion of the Statistical Implications
pdf of visuals, pdf of paper & 4D.1 Questions and Answers
4D.2 Pseudo- Breakdown Events Induced by Biased- Thermal- Stressing of Intra- Level Cu Interconnects - Reliability & Performance Impact
pdf of visuals, pdf of paper & 4D.2 Questions and Answers
4D.3 Stress- Induced Voiding Under Vias Connected To Wide Cu Metal Leads
pdf of visuals, pdf of paper & 4D.3 Questions and Answers
4D.4 Electromigration Study of Cu/ low k Dual- damascene Interconnects
pdf of visuals, pdf of paper & 4D.4 Questions and Answers
4D.5 Electromigration of Cu and Al Using Wafer Level Isothermal Technique
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4D.6 Modeling and Analysis of Via Hot Spots and Implications for ULSI Interconnect Reliability
pdf of visuals, pdf of paper & 4D.6 Questions and Answers

PROCESS INDUCED DAMAGE - Session 5

5.1 (Invited) Use of EEPROM- based Sensors in Investigating Physical Mechanisms Responsible for Charging Damage
pdf of visuals, pdf of paper & 5.1 Questions and Answers
5.2 Influence of Plasma Edge Damage on Erase Characteristics of NOR Flash EEPROM using Channel Erase Method
pdf of visuals, pdf of paper & 5.2 Questions and Answers
5.3 Enhanced Plasma Charging Damage due to AC Charging Effect
pdf of visuals, pdf of paper & 5.3 Questions and Answers
5.4 The Influence of IMD Bake Process on Buried Channel PMOS Hot Carrier Reliability of Advanced DRAM
pdf of visuals, pdf of paper & 5.4 Questions and Answers
5.5 Impact Of Focused Ion Beam Assisted Front End Processing On n- MOSFET Degradation
pdf of visuals, pdf of paper & 5.5 Questions and Answers

PANEL DISCUSSION - PRODUCT QUALIFICATION IN THE 21ST CENTURY

Introduction of Panel Moderator: Bernie Pietrucha
• Automotive Manufacturer Perspective -Product Qualification in the 21st Century
• pdf of visuals
• Present and Future Qualification Methodologies for Automotive Products
• pdf of visuals
• Telecom Market Users View
• pdf of visuals
• Cost of Stress Test Driven Qualification in the 21st Century - A Case History
• pdf of visuals

SPECIAL TOPIC: GERMICIAL IRRADATION

ST.1 (Invited) The Effects of Total Ionizing Dose Irradiation on CMOS Technology and the use of Design Techniques to Mitigate Total Dose Effects
pdf of visuals, pdf of abstract & ST.1 Questions and Answers
ST.2 (Invited) Effects of E- Beam Mail Sanitizing Process on Commercial Electronics
pdf of visuals, pdf of abstracts & ST.2 Questions and Answers
ST.3 (Invited) Filter Optimazation for X- Ray Inspection of Surface- Mounted IC’s
pdf of visuals, pdf of paper

DIELECTRICS II - Session 6

6.1 Imaging Breakdown Spots in SiO₂ Films and MOS Devices with a Conductive Atomic Force Microscope
pdf of visuals, pdf of paper & 6.1 Questions and Answers
6.2 Analysis of Exponential Decay Transient Current in MOS Capacitors
pdf of visuals, pdf of paper & 6.2 Questions and Answers
6.3 Modeling of Substrate Related Extrinsic Oxide Failure Distributions
pdf of visuals, pdf of paper & 6.3 Questions and Answers
6.4 Soft Breakdown Enhanced Hysteresis Effects in Ultra- Thin Oxide SOI nMOSFETs
pdf of visuals, pdf of paper & 6.4 Questions and Answers
6.5 Time- dependent Dielectric Breakdown in Poly- Si CVD HfO₂ Gate Stack
pdf of visuals, pdf of paper & 6.5 Questions and Answers