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1
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- Shang-yi Chiang
- Sr. VP of R&D
- TSMC
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2
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- Foundry Business Model
- Foundry Technology Challenges
- Foundry Quality/Reliabilities Challenges
- Reliability Built-in Technology
- Summary
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3
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- Broad base customers with diverse technology and service requirements
- Core competence in technology, manufacturing, and services
- SC dis-integration enabler
- From dis-integration to virtual integration
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4
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5
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6
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7
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- Leading-edge technology
- Depth and breadth of technology
- SoC integration
- Market segment specific requirements
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8
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9
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10
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11
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12
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13
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14
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15
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- New Materials: Implications to Reliability
- Low-k Dielectrics
- Cu Metallization:
- Stress Migration (SM)
- Stress Induced Voiding (SIV)
- Manufacturing Quality Control
- Advanced Process Control (APC)
- Wafer Level Reliability (WLR)
- Customer Applications
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16
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17
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18
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19
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20
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21
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22
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23
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24
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25
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26
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27
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28
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- Design for reliability
- New material characterization for reliability
- Optimization of process flow
- Simulation during development
- Process reliability simulation
- Overdrive evaluation
- Circuit critical path study
- Reliability evaluation during module development
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29
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- Strong process technology fundamentals
- Reliability evaluation starts in early stage of process development
- Explore wide range of options for materials/process selection
- Close collaboration with customers
- Diverse reliability requirements
- Early engagement
- Reliability built-in foundry technology
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Notes
