VIRTUAL SEMINAR - YEAR-IN-REVIEW

VIRTUAL SEMINAR RELIABILITY—YEAR-IN-REVIEW

on computer DVD-R
held April 4, 2003,
four-hours reviewing 2002 publications on four hot topics,
$75^** ^**requires WIN98SE,ME, 2000,XP & uptodate Internet Explores 5.0 or later

Key Issues on Cu-Low k Interconnect Reliability

EM characteristics of Cu/oxide damascene structures (16 papers).
- Multi-modal failure statistics
- Threshold jLc product
- Void evolution and morphology
- Improvement on EM reliability
Impact of low k dielectrics on EM reliability (7 papers)
- Failure mode and failure statistics
- Interfacial delamination
- Thermal stress and mechanical strength
Stress induced void formation (8 papers)
- Characteristics and mechanism
- Effect of interconnect geometry
- Suppression of stress voiding
Packaging reliability of Cu-low k interconnects (3 papers)

High-k reliability in 2002

Non-Volatile Memory Reliability:2002 Publications

Floating-Gate Memories
- Anomalous SILC
- Program/Erase Operations and Cycling Damage
Nitride Storage Memories
- Thick oxide localized storage
- Thin oxide planar storage
Future Memory Technologies
- Nanocrystal
- Ovonic Unified Memory

ESD

Listen to the reviews by the tour guides while watching the visuals
Bookmarks are provided for the visuals so it is easy to click on each visual to go back or jump ahead
Video inserts included to show the light pointer when being used by the presenter.
Listen to the Questions and Answers as separate files...you can go directly to the Q&A and on some with several questions you can click to the next question or individual questions

1-pg pdf flyer describing the Reliability—Year-In-Review
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