Integration challenges
for
Copper low-k integration

Glenn Alers
Novellus Systems

Solutions to integration problems unique to low-k dielectrics will be presented including photoresist poisoning, k shifts, etch profile control, barrier layers and thermal expansion. The emphasis will be on preferred integration methods for maximum yield with minimum cost.

Glenn Alers

Glenn Alers is Senior Process Manager in the integration group at Novellus Systems. He is responsible for reliability characterization of materials for copper / low-k interconnect structures. Prior to Novellus Systems, he was with Bell Laboratories, Lucent Technologies for seven years where he worked on high-k dielectrics, thin gate oxide reliability and electromigration. He received his Ph.D. in physics in 1991 from the University of Illinois, Urbana-Champaign.