Chair: Dan Barton, Sandia National Laboratories 
Vice Chair: Walter Riordan, Intel

March 30   Sunday Tutorials

Room: Landmark A 

111.  An Introduction to Semiconductor Reliability Vijay Reddy, Texas Instruments  abstract	8:00 – 11:30
112.  Introduction to Predictive Wafer Level Reliability Eric Snyder, Sandia Technologies  abstract	1:30 – 3:00

 

Room: Landmark B

121	ESD Basics Charvaka Duvvury, Texas Instruments abstract		8:00 - 9:30
122	ESD Testing and Failure Analysis for Semiconductor IC's Jonathan Brodsky, Texas Instruments abstract		10:00 - 11:30
123	ESD High Current Phenomena, Modeling and Process Effects Gianluca Boselli, Texas Instruments abstract		1:30 - 3:00
124	Advanced ESD Protection Design Charvaka Duvvury, Texas Instruments abstract		3:30 - 5:00

Room: Landmark C

131.  Problems and Solutions for FA on Advanced Microelectronic Circuits   Chris Henderson, Sandia National Laboratories abstract	1:30 – 3:00
132.  Optical Tools for IC Failure Analysis Ed Cole,Jr., Sandia National Laboratories  abstract	3:30 – 5:00

March 31   Monday Tutorials

Room: Landmark A

211.  Reliable Plastic Encapsulated Microcircuits for Harsh Environments Chuck Reusnow, Lockheed Martin Missiles and Fire Control Brian Russell, Dow Corning  abstract	8:00 – 11:30
212.  Reinventing CMOS: Physics, Reliability and The Roadmap Ted Dellin, Sandia National Laboratories  abstract	1:30 – 5:00

Room: Landmark B

221.  Dielectric Reliability Models and Mechanisms Paul Nicollian, Texas Instruments  abstract	8:00 – 9:30
222.  The Physics of Soft-Breakdown and its Implications for Integrated Circuits Ashraf Alam, Agere Systems  abstract	10:00 – 11:30
223.  Ultra thin oxide reliability in CMOS devices and circuits Jim Stathis, IBM  abstract	1:30 – 3:00
224.  Issues in high-k reliability Robin Degraeve, IMEC  abstract	3:30 – 5:00

Room: Landmark C

231.  Integration Challenges for Copper Low-k Integration Glenn Alers, Novellus  abstract	8:00 – 9:30
232.  Current Challenges of Cu Electromigration Reliability Christine S. Hau-Riege, AMD  abstract	10:00 – 11:30
233.  Impact of Low k on EM Reliability for Cu Interconnects Paul Ho, Univ. of Texas, Austin  abstract	1:30 – 3:00
234.  Interfacial Adhesion and its Impact on Cu Interconnect Reliability Michael Lane, IBM  abstract	3:30 – 5:00

Room: Landmark D

241.  NBTI challenges in PMOSFETs of Advanced CMOS Technologies Guiseppe La Rosa, IBM Microelectronics  abstract

10:00 – 11:30

242.  SER Program Daniel Chesire, Chair, Agere Systems 1. Robert Baumann, TI: Single Event Upsets in Commercial Electronics - From Nuclear Mechanisms to Technology Scaling Trends abstract 2. Steve Wender, Los Alamos: Neutron Single-Event Effects Testing at LANSCE abstract 3. Fred Sexton and Paul Dodd, Sandia: A Comparison of Radiation Sensitivity of Commercial Electronics to the International Traffic in Arms Regulation Levels abstract 4. Mike Tucker, Alpha Sciences: Alpha Particles In Semiconductor Packaging Materials abstract 5. Charles Slayman, Sun Microsystems: Soft Error Rate Correction and Design Requirements for Future Server Memory abstract

1:30 – 5:00