ESD Testing: HBM to vf-TLP

Horst A. Gieser
Fraunhofer IZM

ESD testing must not be limited to the controlled simulation of electrostatic discharge events in an ESD tester according to the stress models Human Body Model, Machine Model and Charged Device Model, which for the purpose of qualification yield only a failure threshold typically in Volts. In addition, Transmission Line Pulse (TLP) systems providing information on both voltage and current are key tools for successful development of ESD protection, especially in an era of increased demand for robustness, in conflict with shrinking feature sizes. The sys-tems differ in their configuration, pulse duration, source impedance and method of pulse metrology. Most of them employ 100ns wide square pulses addressing the domain of the Human Body Model. "Very Fast" TLP systems with pulse lengths as short as few ns address Charged Device Model time scale events of protection devices and structures to be protected. This tutorial provides background information and useful hints for qualification tests with respect to current standards. It further explains 100ns and vfTLP systems in their specific application.

Dr. Horst A. Gieser is head of the department ATIS -Analysis & Test of Integrated Systems at the Fraunhofer-Institute for Reliability and Microintegration, Munich branch. He received his diploma in electrical engineering and his Ph.D. from the Technical University of Munich. He has authored and co-authored more then 50 publications including two books mainly in the field of electrostatic discharge (ESD). Three of them were awarded at international conferences. Currently, he is chairing the Interessengemeinschaft ESD e.V., that supports the exchange of experience in this complex subject by means of a bi-annual symposium called ESD-Forum. He is member of the Technical Program Committee of several international conferences EOS/ESD-Symposium, ESREF, IPFA, ICEMAC. Further interests are in the field of device characterization with ultra-short transients and up to very high frequencies as well as the vertical integration of systems VSIŽ. Beyond ESD the ATIS team is offering advanced services and research in the area of wafer level testing, burn-in, reliability, and product analysis in order to support the microintegration of systems.