MMIC Manufacturing & Packaging Reliability Issues

Drawing on his experience as an active member of JEDEC and his participation with other GaAs industry groups, in addition to his daily involvement with product and process reliability at TriQuint, Bill Roesch will discuss MMIC reliability including the practical aspects of reliability methodology, thermal considerations, failure mechanisms, and acceleration factors. In addition he will address design, environmental, and packaging concerns as well as those nasty field failures that can and do occur - at other companies - of course! Finally, he will outline some guidelines for improving designs, processes, and products to meet the ever-increasing demands of our customers.

Bill Roesch (Rush) is a BSEE Graduate of Oregon State University. He worked for five years at Tektronix on purchased component reliability. 18 years ago, Bill joined TriQuint Semiconductor, where he worked on MESFET reliability. For the past eight years, he has managed the quality and reliability functions at the Oregon Factory. Bill has been active on the JEDEC point committee working on GaAs Reliability and Quality.