Reliability Issues in Advanced Cu/Low-k

abstract not available

Hazara S. Rathore

Hazara S. Rathore is a Senior Technical Staff member in the area reliability in Semiconductor Research and Development Center at IBM Micoelectronics, East Fishkill Facility, Hopewell Junction New York. Presently he is working as a Team Leader to qualify Copper and Low k technologies. He received his B.Sc. From Punjab University, India; M.Sc. From Agra University , India and an other Master in Mechanical Engineering from Stevens Institute of Technology, in 1968. The same year , he joined IBM in East Fishkill, where he has been working in the field of semiconductor reliability.

He has published over sixty five papers and edited ten books in field of semiconductor reliability. He has 16 patents issued , 6 patents pending and 22 technical disclosures published. He is member of JEDEC's 14.2 committee for wafer level reliability and team leader for interconnect group of this committee. He is also member of the executive committee of dielectric science and Technology Division of the Electrochemical Society.

Du B. Nguyen

Du B. Nguyen is an Advisory Reliability Engineering in IBM Microelectronics Division, East Fishkill Facility. He received BSEE (1979) from B.E.I- Fairfield University, Bridgeport CT and MSEE (1982) from Polytechnic Institute of New York, NY.

In 1979, he joined National Semiconductor as a Yield Enhancement Engineer and then as a Process Development Engineer. His expertise included thin film deposition, ion implantation, CMOS device characterization.

Since January 1983, he has been employed by IBM at their East Fishkill Facility, Hopewell Junction, NY in BEOL Reliability Engineering. He has been working in the field of semiconductor reliability, low k- ILD / Cu electromigration, thermal cycle and stress migration, inter- and intralevel time dependent dielectric breakdown (TDDB) on Silicon dioxide and low k- dielectrics . He has published over thirty internal and external technical papers, edited one book, conducted more than ten tutorials on different subjects related to copper interconnects and low k- dielectrics for BEOL applications. He also has eleven patents issued and several other patents pending to his credits on semiconductor BEOL processing and reliability engineering.