(Package Reliability)
Physics of silicon-package interaction with special regard to reliability

The design, speed, performance & degradation, and reliability aspecs of the entire silicon & package are discussed.

Krishna Seshan

Krishna Seshan received an M.Sc in Low Temperature Physics from the University of Lancaster, UK, and a Ph.D. in Materials Science EE from the University of California at Berkeley in 1975. He is involved in aspects of mechanical stress management and the interaction of stress with all device levels. He works as a technical staff member in Intel's 0.25um Process Integration team. His email is krishna.seshan@intel.com.