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Room A
| 101. | Introduction to Gate Oxide Reliability |
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Jim Stathis, IBM abstract | |
8:30 – 12:00 |
| 111. | NBTI in p-MOSFETs: Characterization, Modeling, & Material Dependence |
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Souvik Mahapatra, IIT Bombay, Mumbai, India abstract | |
2:00 – 3:30 |
| 112. | The NBTI challenge spreading from technology to design - Design for Reliability
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Christian Schlünder, Infineon abstract | |
4:00 – 5:30 |
Room B
| 120. |
SER Errors – History, Trends, & Challenges
Helmut Puchner, Cypress Semiconductor abstract |
| (8:30 - 10:00) |
| 130. |
Latch-up
Steve Voldman, IBM abstract |
| (10:30 - 12:00) |
| 140. |
On-chip ESD Protection
Elyse Rosenbaum, Univ. of Illinois at Urbana-Champaign abstract |
| (2:00 - 5:30) |
Room C
| 150. |
Electromigration…From Black to Blech and beyond
Jim Lloyd, IBM abstract |
| (8:30 - 12:00) |
| 160. |
Product Reliability – An Introduction
Robert Kwasnick, Intel abstract |
| (2:00 - 3:30) |
| 170. |
Physics Based Reliability Qualification
Joey Bernstein, University of Maryland abstract |
| (4:00 - 5:30) |
Room D
| 180. |
Introduction to Reliability |
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Ted Dellin, Quick Start Micro Training abstract | |
(2:00 - 5:30) |
Monday, April 16, TUTORIALS · 8 a.m. 2:30 p.m. and YEAR IN REVIEW · 3 p.m. 6:30 p.m., Phoenix Convention Center West Building
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Room A
| 201. |
Mechanics of Interconnects |
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Zhigang Suo, Harvard University abstract | |
(8:00 - 9:30) |
| 202. |
Copper Extendability |
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Glenn Alers, UC Santa Cruz | |
(10 - 11:30) |
| 210. |
Electrically Programmable Fuse – Programming, Reliability and Applications |
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C. Kothandaraman & C.E. Tian, IBM abstract | |
(1:00 - 2:30) |
Room B
| 221. |
CMOS Scaling & Gate Stack Technology Trends |
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Raj Jammy, SEMATECH/IBM & Prashant Majhi, SEMATECH/Intel abstract | |
(8:00 - 9:30) |
| 222. |
Reliability Implication in CMOS & Gate Stack Scaling |
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Rino Choi & Gennadi Bersuker, SEMATECH abstract | |
(10:00 - 11:30) |
| 230. |
Atomic Scale Defects Involved in Modern MOS Gate Stack Reliability Problems |
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Pat Lenahan, The Pennsylvania State University abstract | |
(1:00 - 2:30) |
Room C
| 241. |
NVM Reliability |
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Neil Mielke, Intel abstract | |
(8:00 – 9:30) |
| 242. |
Flash Process Technology Scaling Trends and their Impact to Reliability |
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Kiran Pangal, Intel abstract | |
(10:00 – 11:30) |
| 243. |
NVM – 2 (Embedded Memory)
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Guoqiao Tao, NXP Semiconductors abstract | |
(1:00 - 2:30) |
Room D
| 250. |
Application Specific Reliability and Performance Requirements for High Voltage and Power Devices |
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Sameer Pendharkar, TI abstract | |
(8:00 - 9:30) |
| 260. |
SRAM Scaling - Design and Reliability Challenges due to Stability Issues |
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Stewart Rauch/ Mary Weybright, IBM | |
(10:00 - 11:30) |
| 270. |
Failure Analysis |
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Jim Colvin, Consulting Services
abstract | |
(1:00 - 2:30) |
Year-In-Review · Room TBA
| 301. |
NBTI YEAR-IN-REVIEW |
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Giuseppe LaRosa, IBM
abstract | |
(3:00 - 3:45) |
| 302. |
Assembly Package Interface YEAR-IN-REVIEW |
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Rich Blish, Spansion and Bob Thomas, TEN
abstract | |
(3:45 - 4:30) |
| 303. |
Gate Dielectrics YEAR-IN-REVIEW |
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Tanya Nigam, Cypress Semiconductor
abstract | |
(5:00 - 5:45) |
| 304. |
Non-Volatile Memory YEAR-IN-REVIEW |
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Daniele Ielmini, Politecnico di Milano
abstract | |
(5:45 - 6:30) |
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