Assembly Package Interface YEAR-IN-REVIEW

The YIR on Packaging will include a summary of Packaging papers presented during the year that would be of interest to the IRPS attendees. Several excellent summary papers will be discussed along with new developments in packaging technology. These will include SoC, SoIC, optical integration and new packaging reliability issues presented at other related conferences during the year.

Rich Blish

Rich Blish received B.S. in physics (1963) and Ph.D. in materials science (1967) from Caltech, Pasadena, CA. Rich spent 2 years at Bell Labs, Murray Hill on the PicturePhone project; 11 years at Signetics doing Analytical Chemistry; 15 years at Intel in Package Reliability; 10+ years AMD, now at Spansion. Rich has been granted 42 patents and has published ~40 papers on a wide variety of reliability topics, winning awards for paper quality at IRPS & ECTC. Rich is a past General Chair and Board Chair for IRPS, chaired the Sematech RTAB for 2000 and has been an Editor of IEEE Transactions on Device & Materials Reliability since 2001

Robert Thomas

Robert Thomas received his Ph.D. (1970) in solid state electronics from Syracuse Univ. For 32 years he worked at Rome Air Development Center developing equipment and standards for moisture measurement, investigating electromigration by making in situ SEM movies of hillocks growing and leading a campaign to reduce human contamination during microcircuit manufacturing using a spit film to raise awareness. He was General Chairman of IRPS in 1988, and a member of the Board of Directors for eight years. During his tenure at RADC he managed an analytical laboratory for the Air Force that assessed the quality of military integrated circuits. Retiring from the Air Force in 1992, Dr. Thomas has been consulting as a technical expert in moisture related failures, process control methodology, and management decision making structures. He is an RADC Fellow and a Life Fellow of IEEE.