Eleven workshops and panels covering important topics in reliability physics are available to all symposium registrants. Moderators will discuss topics of current interest and attendees are expected to participate. Attendees are encouraged to prepare questions or bring data on related topics which they may wish to discuss. Overhead projectors will be available in the meeting rooms.
Please note that the workshops will be held on Monday evening after the tutorials. Please register for the workshop of your choice when you register at the conference. Topics and moderators are listed below. For further information on the workshop program contact Bernie Pietrucha (phone 201-386-4730, fax...4147, email: bpietrucha@lucent.com).
Workshop 1. FIB USERS' GROUP: NEW AND CURRENT ISSUES AND APPLICATIONS OF FOCUSED ION BEAM TECHNOLOGY
Moderators - Bryan Tracy, AMD; Marsha Abramo, IBM
New and current issues for FIB will be discussed in this on-going users' group. Participants should contact the moderators prior to the workshop to offer to discuss their recent work (B. Tracy 408-749-4819; M. Abramo 802-769-1737)
Workshop 2. DIELECTRIC RELIABILITY
Moderators - Dave Dumin, Clemson; Paula O'Sullivan, NMRC/Cork; Prasad Chaparala, National Semiconductor
Moderators will lead discussion on physical models vs. engineering models for wearout and breakdown; thin oxide (less than 5 nm) wearout and breakdown, and E vs 1/E extrapolations and predictions vs. reality.
Workshop 3. METAL MIGRATION WITH REFRACTORY SHUNT LAYERS AND BLOCKING BOUNDARIES
Moderators - Bill Baerg, Intel; Jim Lloyd, Lloyd and Thompson Associates; Tim Sullivan, IBM
Topics are limitations for current through a via or a layout of several vias; limits on line width and failure modes (resistance increase, extrusion shorts, thermal gradients) as a function of line width.
Workshop 4. HOT CARRIERS: DEVICE AND CIRCUIT MODELS
Moderators - Tom Kopley, Hewlett-Packard; Hiroshi Inokawa, NTT
Discussion in this workshop will cover device and circuit models for hot carrier reliability and using those models to develop "design for reliability" methodology.
Workshop 5. PLASTIC PACKAGE RELIABILITY
Moderators - Jack McCullen, Intel; Tom Moore, Texas Instruments; Kris Mohan, National Semiconductor
Moderators will focus the group discussion on the reliability issues surrounding plastic packaged devices, addressing both processing and environmental issues.
Workshop 6. PRODUCT RELIABILITY
Moderators - Nick Lycoudes, Motorola; Ted Lach, Lucent Technologies; Gene Hnatek, Tandem Computers, Wayne Ellis, IBM
A product reliability workshop with a different perspective - component reliability and the factors which control product reliability from the OEM perspective.
Workshop 7. WAFER-LEVEL RELIABILITY
Moderators - Cleston Messick, National Semiconductor; Jim Reedholm, Reedholm Instruments; Mike Dion, Harris Semiconductor
Sub-micron geometries require determination of reliability indicators while still in wafer form. Discussion will cover development and implementation of wafer-level test techniques to build reliability into a product.
Workshop 8. FAILURE ANALYSIS - CASE STUDIES
Moderators - Mike Cairnes, Motorola; Mike Strizich, Alliance Analytical; Don Staab, Tandem Computers; Mike Saltmarsh, Motorola; Larry Wagner, Texas Instruments
This workshop will meet in a panel discussion format to discuss that one particularly difficult failure analysis that YOU couldn't resolve. The panel of experts will discuss how THEY might approach your dilemma and then invite other participants to comment. The success of this format depends on YOUR willingness to prepare advance material for the workshop and deliver it to the panel well in advance of the symposium. Click here for information on details for submission of your data and deadlines.
Workshop 9. COMPOUND SEMICONDUCTORS
Moderators - Wallace Anderson, NRL; Paul Ratazzi, Rome Labs
This workshop discussion will build on the work done in the DARPA MIMIC program. Workshop participants can debate the effectiveness of high-temperature RF and DC life testing and discuss the associated failure modes and mechanisms.
Workshop 10. BURN-IN ELIMINATION
Moderators - Carl Peridier, Lucent Technologies; Tim Turner, Keithley
How can you eliminate burn-in and still produce reliable devices? Moderators will lead discussion on how a device manufacturer can work toward eliminating burn-in for specific technologies and what steps need to be taken to maintain defect levels in the ppm range.
Workshop 11. BIR DISCUSSION GROUP
Moderators - John Steeves, Analog Devices; James Prendergast, Analog Devices
The will be the first meeting of this new discussion group at IRPS. Discussion will focus on a broad mix of techniques and methodologies to modify the design and manufacturing processes to incorporate a reliability focus into those processes where it is most cost-effective.