subj: IRPS Keynote Speaker Announced
Dear Guest,
Don't miss the 44th annual IEEE International Reliability Physics Symposium (IRPS) March 26-30, 2006, at the San Jose McEnery Convention Center. Registration site: www.irps.org.
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The 2006 keynote speaker will be Tim Collopy, director for IBM's Technology Group.
The title of Collopy's address is Adaptation of Reliability Methodologies to Market Expectations and Technology Roadmaps. New materials, new structures and the continued drive to smaller feature sizes result in process and design interactions that need to be anticipated, understood and resolved. At the same time, the marketplace is more knowledgeable and demands higher preformance, improved reliability and faster time-to-market. Collopy asserts that fundamental reliability models and qualification methods have not changed in decades. In order to accomodate unique customer requirements (e.g. foundry) or industry standards (e.g. JEDEC) Collopy suggests enhanced quality processes and the stress, analysis and repair of new fail modes uncovered during new technology development. The addition of feedback from the full spectrum of users to verify these models and methods allows for continuous improvement of quality processes, just as customers demand of microelectronic products and technologies.
For more than 40 years, IRPS has been one of the leading meetings for engineers in the area of electronic component reliability. IRPS promotes the comprehension of reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechnisms in the user's environment. Originally started in the early 1960's by the military and aerospace community, IRPS is now sponsored by IEEE Reliability Society and IEEE Electron Devices Society. All accepted IRPS papers will appear in the symposium proceedings publication, as well as on the Virtual IRPS DVD- ROM, which is available now for the previous 2005 IRPS.
Collopy first joined IBM in 1974 and has served in his current position since 2001. He received a B.S. in mathematics from the University of Missouri - Rolla, a B.S. in electrical engineering, an M.S. in operations research, and an M.B.A. in plans and controls from Union College in Schenectady, N.Y. Collopy has previously held management positions in process engineering, diagnostics and characterization, manufacturing engineering, reliability engineering and analytical services at IBM's East Fishkill, N.Y. semiconductor facility.
For more information, or to request technical paper abstracts for the 2006 IRPS, please visit the IRPS Web site at www.irps.org or contact:
Ron Lacoe, IRPS 2006 Publicity Chair, (310) 336-0118 or ronald.c.lacoe@aero.org
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