subj: IEEE International Reliability Physics Symposium, March 26-30, 2006

Dear Guest,

This is your last chance to register for the44th annual IEEE International Reliability Physics Symposium (IRPS) March 26-30, 2006, at the San Jose McEnery Convention Center.  Registration site: www.irps.org.

2006 Keynote Speaker, Tim Collopy, Director for IBM's Technology Group presents: Adaptation of Reliability Methodologies to Market Expectations and Technology Roadmaps

For more than 40 years, IRPS has been a leading conference for engineers working in the area of electronic component reliability.  Originally started in the early 1960s by the military and aerospace communities, IRPS is now cosponsored by the IEEE Reliability Society and the IEEE Electron Devices Society.

Join colleagues from the United States, Europe, and Asia and find out the state of the art in the reliability and performance of integrated circuits and microelectronic assemblies.

Three days of plenary/parallel sessions will feature original work that identifies new microelectronic failure or degradation mechanisms, improves understanding of known failure mechanisms, demonstrates new or innovative analytical techniques, or demonstrates ways to build in reliability.  Specific areas to be addressed during the 2006 IRPS include:

• Product Reliability and Burn-In
• Memories and Microprocessors
• Qualification Strategies
• Circuits and Systems
• Soft Error Effects
• Assembly and Packaging
• Failure and Analysis
• Transistors
• High Power Devices
• Devices and Processing
• Interconnects
• Device Dielectrics
• ESD and Latch-Up
• Process Induced Damage
• MEMS

In addition, approximately 150 technical papers and posters have been selected for presentation for more than 250 peer-reviewed abstracts received.

The 2006 keynote speaker will be Tim Collopy, director for IBM's Technology Group.

The title of Collopy's address is Adaptation of Reliability Methodologies to Market Expectations and Technology Roadmaps.  New materials, new structures and the continued drive to smaller feature sizes result in process and design interactions that need to be anticipated, understood and resolved.  At the same time, the marketplace is more knowledgeable and demands higher performance, improved reliability and faster time-to-market.  Collopy asserts that fundamental reliability models and qualification methods have not changed in decades.  In order to accommodate unique customer requirements (e.g. foundry) or industry standards (e.g. JEDEC) Collogy suggests enhanced quality processes and the stress, analysis and repair of new fail modes uncovered during new technology development.  The addition of feedback from the full spectrum of users to verify these models and methods allows for continuous improvement of quality processes, just as customers demand of microelectronic products and technologies.

Other opportunities at the symposium include:

• A two-day Tutorial Program featuring a set of bound notes from all tutorials.  Attendees have the opportunity to learn a new area in some technical depth from an industry expert or brush up on the fundamentals with introductory tutorials.  There are 24 tutorials that are offered on topics ranging from electromigration to gate dielectric reliability to packaging reliability.
• The Reliability Year-In-Review Seminar will follow the Monday tutorials this year and will provide a summary of important work published from the previous year in key reliability areas.  Industry experts serve as the "tour guide" and save you time by collecting and summarizing this information to bring you up to date in a particular area as efficiently as possible.
• Evening Session Workshops enhance the synergy of the symposium by affording the attendees an opportunity to meet in informal groups to discuss key reliability physics topics with the guidance of experienced moderators.  Some of the workshop topics are directly coupled to the tutorial program to allow more discussion on a particular topic.
• Equipment Demonstrations held in parallel with tutorials and technical sessions are a unique aspect of this symposium.  Manufacturers of state-of-the-art analytical and test and stress equipment are on hand to demonstrate their products and systems to individuals and small groups.  Attendees are encouraged to bring samples or questions for on-site analysis and discussion.
• An Evening Poster Session has become an important part of the IRPS for authors and attendees to discuss recent research and results in a very interactive environment.

Complete information is posted on the IRPS web site at www.irps.org or contact Carole D. Graas, IRPS 2006 General Chair: (802) 769-1214; graas@us.ibm.com

We look forward to seeing you in San Jose!

For publicity related questions, contact Ron Lacoe at ronald.c.lacoe@aero.org

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