41st Annual IEEE International Reliability Physics Symposium
March 30 - April 3, 2003
Dallas, TX USA
To View the IRPS 2003 Call for Papers PDF: Click HerePremier reliability conference promoting a greater understanding of reliability and performance of integrated circuits and microelectronic assemblies in the user's environment. Papers wanted for High-k dielectrics, dual gate devices, low-k and Cu, NBTI, SOI and NVM.
For further information on IRPS 2003, visit www.irps.org. Process Related Sessions:
Device dielectrics: gate oxide, high-k dielectrics and non-volatile memory.
Interconnects: electromigration, stress migration and Cu/low-k reliability.
Transistors: hot carriers, NTBI, transistor scaling, silicon on insulator.
Foundry Reliability: Qualification methods, failure analysis.
Device Reliability: non-Si based optoelectronics, MEMS.
ESD and latch-up.
Product Reliability Sessions:
Product Reliability and Burn-in: wafer level reliability, new failure modes.
Non-Volatile Memories: new failure modes, ferroelectric and magnetic memories.
Qualification Strategies: faster time-to-market, foundry qualification.
Circuits: reliability in designs and circuits, soft errors, analog circuits.
Assembly and Packaging: Cu and low-k issues, multi-chip packaging.
Failure Analysis: new failure mechanisms, novel analytical techniques.
MEMS: reliability testing and analysis of sensors, actuators and MEMS.
Also Available: Complete Virtual IRPS -- 2002. Available on two DVD-ROM volumes. For more information, click here. IRPS 2003
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