IRPS Technical Program Committee

BD - BEOL Dielectrics
Fen Chen,Chair
chenfe@us.ibm.com

CP - Chip-Package Interaction
Choong-un Kim, Chair
choongun@uta.edu

CR - Circuit Reliability
Vijay Reddy, Chair
vreddy@ti.com

EL - ESD and Latchup
Gianluca Boselli, Chair
g-boselli@ti.com

EM - Electromigration/Voiding
Oliver Aubel, Chair
Oliver.Aubel@globalfoundries.com

EX - Extreme Environments
Mark White, Chair
mark.white@jpl.nasa.gov

FA - Failure Analysis
David Su, Chair
david_su@tsmc.com

FP - Fabless & Product Rel
TBD, Chair

GD - Gate Dielectrics
Paul Nicollian, Chair
nicollian@ti.com

HV - High Voltage/RF
Merlyne De Souza, Chair
m.desouza@sheffield.ac.uk

MD - Medical Electronics
Scott Hareland, Chair
scott.hareland@medtronics.com

ME - Thermo-mechanical/MEMS
Ganesh Subarrayan, Chair
ganeshs@purdue.edu

MY - Memory
Sanjay Rangan, Chair
sanjay.rangan@intel.com

PI - Integration/3D/TSV
Jongwoo Park, Chair
jongwoo.s.park@samsung.com

PV - Photovoltaic Devices
S. Ashok, Chair
sxa4@psu.edu

SE - Soft Errors
Jeff Wilkinson, Chair
jeff.wilkinson@medtronic.com

XT - Transistor/Organics TFTs
Tanya Nigam, Chair
Tanya.Nigam@globalfoundries.com