Information for Authors

***The deadline for for Late News submissions is January 11, 2016.***

The 2016 IEEE International Reliability Physics Symposium will be held April 17-21, 2016 - Pasadena Convention Center, Pasadena, CA, USA

IRPS offers its attendees technical sessions, tutorials, workshops, a year-in-review seminar and a poster session, all covering state-of-the-art developments in the reliability physics of devices, materials, circuits, and products used in the electronics industry.

Attendees returning from the IRPS will be better equipped to solve critical reliability problems and develop effective qualification procedures that affect their companies’ bottom line.

For detailed information for the 2016 IRPS submission, click here for the 2016 IRPS Call for Papers

  • Identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems;
  • Identify how fabrication processes influence the susceptibility of product to particular physical failure mechanisms;
  • Quantify the impact of device and circuit design, as well as material and process selection on reliability;
  • Present new, innovative, or improved failure analysis techniques;
  • Describe reliability testing/stressing, qualification, and screening methodologies or strategies for materials, devices, circuits, or chips; either at wafer- or module-level for commercial or “extreme” environments;
  • Demonstrate techniques to build-in or extend reliability while meeting performance goals, especially as technologies are scaled.

Awards: In addition to the Best & Outstanding Paper awards and the Best Poster award, IRPS will be presenting a Best Student Paper Award. To qualify for the student paper award, the IRPS oral presentation must be given by a student and the first author must be that same student. Please indicate upon submission of an abstract if you would like to be considered for this award.