Program Committee

Technical Program Chair
Yuan Chen, NASA

Technical Program Vice-Chair
Chris Connor, Intel

International Liasion Chair
Susumu Shuto, Toshiba

International Liasion Co-Chair
Yen-Hao Shih, Macronix International Co., Ltd.

3D - 3D/TSV Reliability
Kristof Croes, Chair
imec
Chandrasekara Kothandaraman, Co-Chair
IBM

BD - BEOL Dielectric
Fen Chen, Chair
IBM
Shou-Chung Lee, Co-Chair
TSMC

CP - Chip Packaging Reliability
Alan Lucero, Chair
Intel
Christine Hau-Riege, Co-Chair
Qualcomm

CA - Circuit Aging/Circuit Reliability
Keith Green, Chair
Texas Instruments

CD - Compound/Opto Electronics
Denis Marcon, Chair
imec
Jungwoo Joh, Co-Chair
Texas Instruments

ER - Electronic Systems
Reliability

Ajay Kamath, Chair
Google
Amit Marathe, Co-Chair
Microsoft

EL - ESD and Latchup
Gianluca Boselli, Chair
Texas Instruments

Junjun Li, Co-Chair
Apple

FA - Failure Analysis
Travis Eisles, Chair
Intel
Shuichi Kudo, Co-Chair
Renesas

  

GD - Gate Dielectrics
Reliability

Yung-Huei Lee, Chair
TSMC
James Stathis, Co-Chair
IBM

IT - Interconnect Metalization
Reliability

Baozhen Li, Chair
IBM
Feng Xia, Co-Chair
Intel

MY - Memory
Chandra Mouli, Chair
Micron
Shosuke Fujii, Co-Chair
Toshiba

PI - Process Integration
Steve Ramey, Chair
Intel
Motoyuki Sato, Co-Chair
Toshiba

PR - Product IC Reliability
You Wen Yau, Chair
Qualcomm
Sangwoo Pae, Co-Chair
Samsung

SE - Soft Errors
Ethan Cannon, Chair
Boeing
Eishi Ibe, Co-Chair
Hitachi

XT - Transistor Reliability Physics
Souvik Mahapatra, Chair
IIT Mumbai
Andreas Kerber, Chair
Globalfoundries