Program Committee

Chris Henderson, Technical
Program Chair

Semitracks

Chris Connor,Vice Technical
Program Chair

Intel

Susumu Shuto, International Liasion Chair
Toshiba

Yen-Hao Shih, International Liasion Co-Chair
Macronix International Co., Ltd.

3D - 3D/TSV Reliability
Steve Groothuis, Chair
Micron Technology
Sudarshan Rangaraj, Co-Chair
Intel
Luke England, GLOBALFOUNDRIES
Raman Kothandaraman, IBM
Scott Pozder, Novati Technologies
Margaret Simmons, ASE Group
Ahmer Syed, Qualcomm
Ian Talbot, Cambridge Silicon Radio

BD - BEOL Dielectric Reliability
Oliver Aubel, Chair
GLOBALFOUNDRIES
Fen Chen, Co-Chair
IBM

Sanghoon Ahn, Samsung
Emmanuel Chery, STMicroelectronics
Martin Gall, Fraunhofer
Shou-Chung Lee, TSMC
Jim Lloyd, Suny
Michael Roehner, Infineon
Feng Xia, Intel
Kong-Boon Yeap,
GLOBALFOUNDRIES
Tokei Zsolt, IMEC

CP - Chip-Package Interaction
(TSV/3D)

Kristof Croes, Chair
IMEC
Alan Lucero, Co-Chair
Intel

Sungdong Cho, Samsung
Chandrasek, IBM
Shiguo (Richard) Rao, Vitesse
Semiconductor Corp
Vivian Ryan, GLOBALFOUNDRIES

CA - Circuit Aging Simulation/
Circuits Reliability

Keith Green, Chair
Texas Instruments
Yu Cao, Co-Chair
ASU

Florian Cacho, STMicroelectronics
Vikas Chandra, ARM
Michael Hauser, IBM
Min-Chie Jeng, TSMC
Chris Kim, University of Minnesota
Haldun Kufluoglu, Texas Instruments
Tony Oates, TSMC
Ahmed Ramadan, Mentor
Vijay Reddy, Texas Instruments
Takashi Sato, Kyoto University
Senthil Thirunavukarasu, Broadcom
James Tschanz, Intel
Bill Vanderlinde, Univ. of Maryland
Steve Walstra, Intel

CD - Compound/Opto
Electronics

Eric Heller, Chair AFRL
Jose Jimenez, Co-Chair
Triquint Semiconductor

Andy Barnes, ESA
Karim Boutros, HRL Laboratories
Jungwoo Joh, Texas Instruments
Martin Kuball, University of Bristol
Paul Maki, ONR
Denis Marcon, IMEC
Gaudenzio Meneghesso, Univ. of
Padova
Rama Vetury, RFMD

ER - Electronic Systems
Reliability

Amit Marathe, Chair
Microsoft
Ajay Kamath, Co-Chair
Google

Ronald Bolam, IBM
Raif Hijab, Broadcom
Gautam Kapila, Texas Instruments
Aamir Kazi, Dell
Michael Su, AMD
Kok Yiang, Amazon Lab126

EL - ESD and Latchup
Steven Voldman, Chair
Ind. Consultant
Ming Dou Ker, Co-Chair
National University of Taiwan

Joseph Bernstein Bar-Ilan, Univ. Tel
Aviv
Shu Qing (Victor)Cao,
GLOBALFOUNDRIES
Han Gu Kim, Samsung
Pey Kin-Leong Singapore, Univ of
Technology and Design (SUTD)
Savica Malobabic, Consultant
Jo Chiranut Sa-ngiamsak, Khon Kaen
University
Miko Scholz, IMEC
Zhi Wei Liu,UESTC

FA - Failure Analysis
Shuichi Kudo, Chair
Renesas Ed Cole, Co-Chair
Sandia National Labs

Travis Eiles, Intel
Yong-Fen Hsieh, Materials Analysis
Technology Inc.
Andreas Meyer,
GLOBALFOUNDRIES
Kiyoshi Nikawa, Kanazawa Inst. of
Technology
Philippe Perdu, CNES
Kevin Sanchez, CNES

  

GD - Gate Dielectrics
Jeff Hicks, Chair
Intel
Yung-Huei Lee, Co-Chair
TSMC

Gennadi Bersuker, SEMATECH
Lin Cong, Nvidia
Suman Datta, Penn State University
Izumi Hirano, Toshiba
Ahmad Islam, Air Force Lab
Thomas Kauerauf, IMEC
Andreas Kerber, GLOBALFOUNDRIES
Ziyuan Liu, Renesas
Paul Nicollian, Semiconductor Reliability Inc.
Andrea Padovani, Univ. di Modena e
Reggio Emilia
Kin-Leong Pey, Nanyang Technologies
Anisur Rahman, Intel
Hyun-Chul Sagong,   Samsung
Gautam Verma, Altera

IT - Interconnect Metalization
Reliability

Cathryn J Christiansen, Chair
IBM
Howard Gan, Co-Chair
SMIC

Christine Hau-Riege, Qualcomm
Meike Hauschildt, GLOBALFOUNDRIES
Ki-Don Lee, Texas Instruments
Baozhen Li, IBM
Chin Chang Liao, UMC
Anthony Oates, TSMC
Cher Ming Tan, Nanyang Technological Univ.
Shinji Yokogawa, National Polytechnic Univ.

MY - Memory
Alessandro Spinelli, Chair
Politecnico Milano
Shosuke Fujii, Co-Chair
Toshiba

Seiichi Aritome, SKHynix
Andrea Chimenton, Intel
Youongwoo Park, Samsung
Fabio Pellizzer, Micron
Wen-Jer Tsai, Macronix
Elisa Vianello, CEA-LETI
Renichi Yamada, Hitachi

SN - MEMS Sensor Reliability
Georgios Papaioannou, Chair
University of Athens
Michael Nicoladis, Co-Chair
IMAG

Elena Blokhina, Univ. College Dublin
Ingrid DeWolf, IMEC
F. Giacomozzi, FBK Trento
Evgeni Gousev, Qualcomm
Gan Chee Lip, Nanyang Technological Univ.
Frederic Souchon, CEA Grenoble

PI - Process Integration
Motoyuki Sato, Chair
Toshiba
Xavier Garros, Co-Chair
CEA-LETI

Marc Heyns, Imec
Klaus Hummler, Sematech
Hiroshi Miki, Hitachi
Stephen Ramey, Intel
Guillaume Ribes, STMicroelectronics

PR - Product IC Reliability
Sangwoo Pae, Chair
Samsung
Youwen Yau, Co-Chair
Qualcomm

Amr Haggag, Freescale
Gerry Leatherman, Intel
Steven Mittl, IBM
Andreas Preussger, Infineon
Guillaume Ribes, STMicroelectronics
Masumi Saitoh, Toshiba
J.R. Shih, TSMC

SE - Soft Errors
Ethan Cannon, Chair
Boeing
Norbert Seifert, Co-Chair
Intel

Jean Luc Autran, Aix-Marseille Université
Mike Dion, Rockwell Collins
Adrian Evans, iROC
Eishi Ibe, Hitachi
Klas Lilja, Robust Chip
Nihaar Mahatme, Vanderbilt Univ.
Balaji Narasimham, Broadcom
Alexander Narr, GLOBALFOUNDRIES
Heather Quinn, LANL
Philippe Roche, STMicroelectronics
Taiki Uemura, Fujitsu
Shi-Jie Wen, Cisco

XT - Transistor
James H Stathis, Chair
IBM
Souvik Mahapatra, Chair
IIT Mumbai

Jason Campbell, NIST
Shweta Deora, Sematech
Merlyne DeSouza, Univ. Sheffield
Xavier Federspiel, STMicroelectronics
Ru Huang, Peking Univ.
Kyoung-Taek Lee, Samsung
Yuchiro Mitani, Toshiba
Luigi Pantisano, GLOBALFOUNDRIES
Paolo Pavan, UNIMORE
Nagarajan Raghavan, SUTD
Stephen Ramey, Intel
Ivan Sanchez-Esqueda, USC
Christian Schluender, Infineon
Maria Toledano Luque, IMEC
Dhanoop Varghese, Texas Instruments