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Program Committee
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Giuseppe La Rosa, Technical Program Chair
BC - Technologies/Devices beyond CMOS
BD - BEOL Dielectrics
CP - Chip-Package Interaction
CM - Compact Modeling
CR - Circuit Reliability
CD - Compound/Opto Electronics
ER - Electronic Systems Reliability
EM - Electromigration
EL - ESD and Latchup |
Charles Slayman, Vice Program
FA - Failure Analysis
GD - Gate Dielectrics
ME -MEMS
MY - Memory
Glen Alers, Chair UCSC galers@ucsc.edu
PR - Product IC Reliability
PI - Process Integration
SE - Soft Errors
XT - Transistor |