Keynote 1: "Transistors and Reliability in the Innovation Era", Kaizad Mistry, Vice President and Director of Logic Technology Integration, Logic Technology Development Group, Intel Corporation
Traditional transistor scaling drive the semiconductor industry through the 1990s, but led to the era of innovation driven transistor scaling. Strained silicon, high-k plus metal gate transistors, and fin based transistors were some of the key innovations in the last several process technology generations. This presentation will explore both the transistor scaling benefits from these innovations as well as the reliability implications covering the 90nm to 14nm timeframe.
Luncheon Date and Time:Wednesday, April 22, from 12:15 p.m. to 2:15 p.m.
The Path to High Reliability in Consumer Electronics, Pat Tang, Director of Product Integrity, Amazon Lab126
How can high reliability be achieved in fast paced consumer electronics? With competing pressures of time to market, cost and feature set, how can reliability be effectively incorporated into the product. This talk will examine a product integrity vision based on 3 technical strategies:
1. Design for reliability through simulation tools;
2. Quantifying the cost of field failure to the overall business;
3. Development of customer-use centric standards.
The path to incorporating these strategies has been long and arduous but has ultimately led to higher reliability and customer satisfaction. Technical examples with lessons learned will be given to detail how this works in practice. This presentation also aims to open the path towards a consumer electronics reliability standard and methods to be applied to the most popular electronic products today.
Pat Tang joined Amazon in 2010 as Director of Product Integrity, responsible for the architectural integrity and product reliability of Amazon’s Kindle Fire tablets, e-readers, Fire TV and Fire Phone products. He built teams of architectural simulation and materials testing, product reliability qualification and database field analysis for warranty cost. By using cloud-based simulation to aid design, thin, lightweight and reliable products like Kindle Fire HDX 8.9 and Kindle Paperwhite were realized.
Pat was previously at Apple where he was the reliability manager responsible for the qualification of Mac products: Macbook Pro, Macbook Air, iMac, MacPro, AppleTV and the first prototypes of iPad. Here he introduced large-scale reliability waterfalls to combine different stresses to replicate field use.
With interests in Physics and design Pat has also: designed the sensor pattern in Apple’s Magic trackpad; designed and patented a semiconductor sensor for green house gases; designed power amplifier probes to perform RF measurements at wafer level; conducted theoretical and empirical research of semiconductor quantum wells for opto-electronics. Patrick holds a PhD degree in Physics from Imperial College UK and has over 30 publications.
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