Circuit Reliability / Aging
Gate / MOL Dielectrics
Emerging Memory Reliability
ESD / Latchup
Failure Analysis
GaN Power Devices

Packaging and 2.5D/3D Assembly

• Chair: Mohammad Enamul Kabir, Intel

• Vice-Chair: Nikholas Toledo, Microsoft

• Chair Emeritus: Preeti Chauhan, Google

  Ravi Aggarwal, Intel
  Anandaroop Bhattacharya, IIT Kharagpur
  Jacob Bow, Intel
  Yun Ge, Apple
  Nicholas Ginga, The University of Alabama in Huntsville
  Enamul Kabir, Intel
  Bahattin Kilic, Google
  Chang-Chun Lee, National Tsing Hua University (NTHU)
  Kangwook Lee, SK Hynix
  Ashok Pachamuthu, Western Digital Corporation
  S. B. Park, The State University of New York, Binghamton
  Nipun Sinha, Meta
  Abhijeet Dhiman, Intel
  Lyun-Lin Wu, TSMC

Circuit Reliability and Aging

• Chair: Robert Jin, NXP

• Vice-Chair: Kanad Basu, University of Texas at Dallas

• Chair Emeritus: Kazutoshi Kobayashi, Kyoto Institute of Technology

  Javier Diaz Fortuny, Imec
  Jeff Gambino, Onsemiconductor
  Mitsuhiko Igarashi, Renesas Electronics
  Saibal Mukhopadhyay, Georgia Institute of Technology
  Vijay Reddy, Texas Instruments
  Mehdi Sadi, Auburn University
  Hyewon Shim, Samsung
  Pieter Weckx, Imec

Gate/MOL Dielectrics

• Chair: Stanislav Tyaginov, imec

• Vice-Chair: Zakariae Chbili, Intel

• Chair Emeritus: Andrea Padovani, Università degli Studi di Modena e Reggio Emilia

  Masakazu Goto, Kioxia
  Fei Hui, Techion
  Zhigang Ji, Shangai Jiaotong University
  Alicja Lesniewska, imec
  Pei Jean Liao, TSMC
  Hideki Minari, Sony
  James Palmer, Intel
  Felix Palumbo, Conicet
  Nagarajan Raghavan, Singapore University of Technology and Design
  Susanna Reggiani, University of Bologna
  Gerhard Rzepa, Global TCAD
  Maria Toledano Luque, GlobalFoundries
  Ernest Wu, IBM
  Chen Wu, imec

Emerging Memory

• Chair: SangBum Kim, Seoul National University

• Vice-Chair: Carlo Cagli, CEA-LETI/ST

• Chair Emeritus: Barry O’Sullivan, imec

  Yusuke Higashi, Kioxia
  Keizo Hiraga, Sony
  Guohan Hu, IBM
  Dae-Hwan Kang, Samsung
  Joe McCrate, Micron
  Kai Ni, Rochester Institute of Technology
  Jaeyun Yi, SK
  Pei-Ying Du, Macronix
  Davide Fugazza, Intel
  Seyoung Kim, Postech

ESD snf Latchup

• Chair: Nathaniel Peachey, Qorvo

• Vice-Chair: Lorenzo Cerati, ST

• Chair Emeritus: Michael Stockinger, NXP

  Scott Ruth, AMD
  Mirko Scholz, Infineon Technologies
  Teruo Suzuki, Socionext
  Shih-Hung Chen, IMEC
  Mariano Dissegna, Texas Instruments
  ChanHee Jeon, Samsung

Failure Analysis

• Chair: Michael Gribelyuk, Western Digital

• Vice-Chair: Jayhoon Chung, Texas Instruments

• Chair Emeritus: Eckhard Langer, GlobalFoundries

  Bryan Tracy, Tesla
  Yong Guo, Samsung
  WooYoung JUng, SK Hynix
  Hong Ryong Kim, Texas Instruments

GaN Power Device

• Chair: Srabanti Chowdhury, Stanford University

• Vice-Chair: Andrew Binder, Sandia National Lab

• Chair Emeritus: Kaustubh Joshi, Intel

  Davide Bisi, Transphorm Inc.
  Julien Buckley, CEA/LETI
  Kevin J Chen, HKUST
  Okita Hideuki, Panasonic
  Matteo Meneghini, U. Padova
  Clemens Ostermaier, Infineon
  Bhawani Shankar, Stanford
  Tsutomu Uesugi, Nagoya University
  Shireen Warnock, MIT Lincoln Lab
  Shuzhen You, Xidian University

Memory Reliability

• Chair: Yuichiro Mitani, Tokyo City University

• Vice-Chair: Andrea Chimenton, Intel

• Chair Emeritus: Shu-jen Lee, Intel

  Ming-Yi Lee, Macronix
  Jin LYU, YMTC
  Gabriele Navarro, CEA-Leti
  Jeong-Hoon Oh, Samsung
  Biswajit Ray, The University of Alabama in Huntsville
  Seong-wan Ryu, SK Hynix
  Yuri Tkachev, Silicon Storage Technology
  Simon Van Beek, imec
  Naoki Yasuda, Kioxia
  Jung Yoon, IBM
  Cristian Zambelli, University of Ferrara

Metallization / BEOL Reliability

• Chair: Andrew Kim, Texas Instruments

• Vice-Chair: Baozhen Li, IBM

• Chair Emeritus: Ming-Hsien Lin, TSMC

  Seungman Choi, GlobalFoundries
  Kristof Croes, IMEC
  Gavin Hall, Infineon
  Sumy Jose, NXP
  Rahim Kasim, Intel
  Ki-Don Lee, Samsung
  Valeriy Sukharev, Mentor Graphics
  Cher Ming Tan, Chnag Gung University
  Ping-Chuan Wang, SUNY New Platz
  Shinji Yokogawa, Univ. Electro-Communications

Neuromorphic Computing Reliability

• Chair: Stefano Ambrogio, IBM

• Vice-Chair: Bin Gao, Tsinghua University

• Chair Emeritus: Tuo-Hung Hou, National Chiao Tung University

  Hiro Akinaga, National Institute of Advanced Industrial Science and Technology (AIST)
  Gennadi Bersuker, AERO
  Yao-Feng Chang, Intel
  An Chen, IBM
  Arthur Edwards, AFRL/RVSV
  Doo Seok Jeong, Hanyang University
  Masaharu Kobayashi, University of Tokyo
  Matthew Marinella, Sandia Lab.
  Gabriel Molas, Weebit
  Sabina Spiga, CNR
  John Paul Strachan, Jülich Research Centre
  Rainer Waser, RWTH Aachen University
  Pey Kin Leong, SUTD

Process Integration

• Chair Purushothaman Srinivasan, Global Foundries

• Vice-Chair Richard G (Ricki) Southwick, IBM

• Chair Emeritus Guido Sasse, NXP

  Jean Coignus, CEA Leti
  Cheikh Diouf, STM
  Alexander Grill, IMEC
  Jen-Hao Lee, TSMC
  Hiroshi Miki, Hitachi
  Mustapha Rafik, Aledia
  Rakesh Ranjan, Samsung
  Hyunchul Sagong, KATECH
  Motoyuki Sato, Tokyo Electron
  Andreas Martin, Infineon
  Anisur Rahman, Intel

Product Reliability

• Chair: Ming-Han (Hank) Hsieh, MediaTek

• Vice-Chair: Feng Xia, Intel

• Chair Emeritus: Sandhya Chandrashekhar, Google

  Davide Appello, ST Microelectronics
  Paolo Bernardi, Politecnico di Torino
  Ryan Lu, TSMC
  Richard Rao, Marvel
  Mihaela (Maria) Tanasescu, AMD
  Xinggong Wan, Globalfoundries
  Yuan Zhang, Amazon

Reliability Testing

• Chair: Samia A. Suliman, The Pennsylvania State University

• Vice-Chair: Stephane Moreau, CEA Leti

• Chair Emeritus: Yi Zhao, Zhejiang University

  Osama Awadelkarim, Penn State University
  Saptarshi Das, Penn State University
  Hosain Farr, Qualitau Inc.
  Yanjun Feng, Canoo Inc.
  Helene Fremont, University of Bordeaux
  Jifa Hao, Google
  Bob Keller, NIST
  Linfei (Jamie) Li, Cadence
  Kevin Manning, Analog Devices
  Rossetti Mattia, ST Microelectronics
  Fiorella Pozzobon, ST Microelectronics
  Dirk Rudolph, Globalfoundries
  Derek Slottke, Intel
  Wangran Wu, Southeast University
  Qu Yiming, East China Normal University

RF / mmW / 5G

• Chair: Don Gajewski, CREE/Wolfspeed

• Vice-Chair: Sriram Kalpat, Qualcomm

• Chair Emeritus: Fernando Guarin, Global Foundries

  Karim Boutros, Boeing
  Chris Bozada, Air Force Research Laboratory
  Michael Dammann, Fraunhofer Institute
  Alexis Divay, CEA Leti
  Gergana Drandova, Qorvo
  Xavier Federspiel, ST Microelectronics
  Satyaki Ganguly, Wolfspeed
  Craig Gaw, NXP
  Sriram Kalpat, Qualcomm
  Nathalie Malbert, University of Bordeaux
  Farid Medjdoub, CNRS
  Vijay Reddy, Texas Instruments
  Rosana Rodriguez, Universitat Autonoma de Barcelona
  Purushothaman Srinivasan, Globalfoundries
  Hao Yu, IMEC
  Enrico Zanoni, University of Padua

Radiation Effect Reliability (Soft Errors)

• Chair: Haibin Wang, Hohai University

• Vice-Chair: Chundong Liang, Amazon AWS

• Chair Emeritus: Paula Chen, AMD

  Taiki Uemura, Samsung
  Laurent Artola, ONERA
  Sang Baeg, Hanyang University
  Li Chen, University of Saskatchewan
  Yi-Pin Fang, TSMC
  Rita Fung, Cisco
  Gilles Gasiot, STMicroelectronics
  Masanori Hashimoto, Kyoto University
  Bo Li, Institute of Microelectronics, Chinese Academy of Sciences
  Nihaar Mahatme, NXP

System Electronics Reliability

• Chair: Kok Yiang, Amazon Lab126

• Vice-Chair: Phil Joseph Oldiges, Sandia

• Chair Emeritus: Yan Liu, Medtronic

  Jyotika Athavale, NVIDIA
  Rob Kwasnick, Intel
  Florian Moliere, Airbus
  Yi-Ching (YC) Ong, TSMC
  Nikolaos Papandreou, IBM Research Zurich
  Rich Pietri, Apple
  Jay Sarkar, Micron
  Emma Schmidgall, Microsoft
  David Sunderland, Boeing (retired)

Transistors

• Chair: Runsheng Wang, Peking University

• Vice-Chair: Eunae (Grace) Chung, Samsung

• Chair Emeritus: Bonnie Weir, Broadcom

  Alain Bravaix, IM2NP (ST Micro)
  Adrian Chasin, IMEC
  Nilesh Goel, BITS Pilani Dubai Campus
  Wen Liu, Globalfoundries
  Javier Martin-Martinez, Universitat Autonoma de Barcelona
  Kazuki Nomoto, Sony Semiconductor Solutions
  Chetan Prasad, Intel
  Uma Sharma, Micron
  Pragya Shrestha, NIST
  Seunghun Son, SK Hynix
  Dhanoop Varghese, Texas Instruments
  Michael Waltl, TU Wien
  Miaomiao Wang, IBM
  Nuo Xu, TSMC
  Zhuoqing Yu, Huawei HiSilicon

Wide-Bandgap Semiconductors (SiC)

• Chair: Peter Losee, United SiC

• Vice-Chair: Ulrike Grossner, ETH Zurich

• Chair Emeritus: Daniel Lichtenwalner, Wolfspeed

  Akin Akturk, CoolCAD Electronics
  Thomas Basler, TU Chemnitz
  Alexander Boltnikov, On-Semiconductor
  Charles Cheung, NIST
  Patrick Fiorenza, Italian National Research Council
  Ron Green, US Army Research Lab.
  Junji Senzaki, AIST
  Heiji Watanabe, Osaka University