• Packaging and 2.5 / 3D Assembly

• Circuit Reliability and Aging

• Dielectrics Relibility

• Emerging Memory

• ESD and Latchup

• Failure Analysis

• GaN Devices

Packaging and 2.5D/3D Assembly

• Chair: Zhi Yang, Nvidia

• Vice-Chair: Chih Chen, National Yang Ming Chiao Tung University (NYCU)

• Chair Emeritus: Jyun-Lin Wu, TSMC

  David Chu, TSMC

  Nicholas Ginga, The University of Alabama in Huntsville

  Kangwook Lee, SK Hynix

  Chang-Chun Lee, National Tsing Hua University (NTHU)

  Nipun Sinha, Meta

  Sevket Yuruker, Tesla

Circuit Reliability and Aging

• Chair: Victor M. van Santen, Technical University of Munich

• Vice-Chair: Rafael Castro Lopez, IMSE-CNM

• Chair Emeritus: Jeff Gambino, Onsemiconductor

  Ricardo Ascazubi, Intel

  Albert Crespo Yepes, Universitat Autonoma de Barcelona

  Mitsuhiko Igarashi, Renesas

  Saibal Mukhopadhyay, Georgia Institute of Technology

  Vijay Reddy, Texas Instruments

  Mattia Rossetti, STMicroelectronics

  Hyewon Shim, Samsung

  Graham Woods, Synopsys

  Mustafa Berke Yelten, Istanbul Technical University

Dielectrics Reliability

• Chair: Susanna Reggiani, University of Bologna

• Vice-Chair: Suresh Uppal, Rivos

• Chair Emeritus: Gerhard Rzepa, Global TCAD Solutions

  Ruben Asanovski, IMEC

  Yu-Kai Chang, TSMC

  Fei Hui, Zhengzhou University

  Paolo La Torraca, Tyndall National Institute

  Stephen Moxim, NIST

  James Palmer, Intel

  Felix Palumbo, Allegro MicroSystems

  Nagarajan Raghavan, Singapore University of Technology and Design

  Viktoria Schlykow, KIOXIA Corporation

  Richard Southwick, IBM

  William Vandendaele, CEA-Leti

  Ernest Wu, University of Vermont

  Weiman Yan, University of Illinois at Urbana-Champaign

Emerging Memory

• Chair: Devanarayanan Ettisserry, Micron

• Vice-Chair: Keizo Hiraga, Sony

• Chair Emeritus: Kai Ni, University of Notre Dame

  Hyejung Choi, SK hynix

  Davide Fugazza, Intel

  Xiao Gong, National University of Singapore

  Laurent Grenouillet, CEA-Leti

  Yusuke Higashi, IMEC

  Tzu-Hsuan (Bruce) Hsu, Macronix

  Hao Jiang, Fudan University

  Hyunsung Jung, Samsung

  Hyungjin Kim, Hanyang University

  Seyoung Kim, POSTECH

  Tania Roy, Duke University

  Dutta Sourav, University of Texas at Dallas

  Rina Takashima, Kioxia

ESD and Latchup

• Chair: Mohammed Fakhruddin, Intel

• Vice-Chair: Dolphin Abessolo Bidzo, NXP

• Chair Emeritus: Mirko Scholz, Infineon Technologies

  Shih-Hung Chen, AMD

  Mariano Dissegna, TI

  Prantik Mahajan, Renesas Electronics

  Slavica Malobabic, Cirrus Logic

  Mujahid Muhammad, Rapidus

  Mototsugu Okushima, Renesas

  Steven S. Poon, TSMC

Failure Analysis

• Chair: Don Gajewski, Wolfspeed

• Vice-Chair: Baohua Niu, Intel

  Piet De Pauw, Reliability and FA Consultant

  Kristof Jacobs, IMEC

  Sriram Nithin Gopal Lanka, AMD

  Sandeep Rekshi

  Nataliya Starostina

GaN Devices

• Chair: Bhawani Shankar, Power Integrations

• Vice-Chair: Matteo Borga, IMEC

• Chair Emeritus: Matteo Meneghini, University of Padova

  Rajarshi Roy Chaudhuri, TU Wien

  Christian Koller, Infineon

  Romain Laviéville, CEA Leti

  Yunwei Ma, Texas Instruments

  Maurizio Millesimo, University of Bologna

  Brian Rummel, Sandia National Labs

  Valeria Rustichelli, IRT-Saint Exupery

  Kurt Smith, VisIC Technologies

  Rohith Soman, Stanford University

  Manikant Suryawanshi, Coherent Corporation

  Tetsuzo Ueda, Kansai University

  Shuzhen You, Xidian University

  Nicolo' Zagni, Universita' di Modena e Reggio Emilia

  Ke Zeng, University of North Carolina

Memory Reliability

• Chair: Naoki Yasuda, Kioxia

• Vice-Chair: Gabriele Navarro, CEA-Leti

• Chair Emeritus: Biswajit Ray, Colorado State University

  Karine Florent, Micron

  Anna Gandolfo, STMicroelectronics

  Zhigang Ji, Shanghai Jiao Tong University

  Jaeduk Lee, Samsung

  Gerardo Malavena, Polytechnic University of Milan

  Nellina Mautone, Infineon

  Milan Pesic, Applied Materials

  Giuseppina Puzzilli, Solidigm

  Pitamber Shukla, Microchip

  Toru Tanzawa, Waseda University

  Po-Hao Tseng, Macronix

  Seol-Min Yi, SK hynix

Metallization / BEOL Reliability

• Chair: Sumy Jose, NXP

• Vice-Chair: James Zhang, Intel

• Chair Emeritus: Ping-Chuan Wang, SUNY New Paltz

  Arief Budiman, Oregon Institute of Technology

  Hajdin Ceric, TU Wien

  Seungman Choi, GlobalFoundries

  Huai Huang, IBM

  Andrew Kim, Sandia National Laboratory

  Ming-Hsieh Lin, TSMC

  Eitan Shauly, TowerSemi

  Olalla Varela Pedreira, IMEC

  Shinji Yokogawa, UEC

  Ying-Hong Zhao, Samsung

Neuromorphic Computing Reliability

• Chair: Hiro Akinaga, Hokkaido University

• Vice-Chair: Yao-Feng Chang, Cisco

• Chair Emeritus: An Chen, IBM

  Gennadi Bersuker, M2D

  Gao Bin, Tsinghua University

  Vita Pi-Ho Hu, National Taiwan University

  Doo Seok Jeong, Hanyang University

  Masaharu Kobayashi, University of Tokyo

  Matthew Marinella, Arizona State University

  Gabriel Molas, Weebit

  Nagarajan Raghavan, Singapore University of Technology and Design

  Sabina Spiga, CNR - IMM

  Stefan Wiefels, PGI Juelich

  Tommaso Zanotti, University of Modena & Reggio Emilia

Process Integration

• Chair: Rakesh Ranjan, Samsung

• Vice-Chair: Hyunchul Sagong, Dankook University

• Chair Emeritus: Motoyuki Sato, Tokyo Electron

  Eliot Chen, TSMC

  Cheikh Diouf, ST Microelectronics

  Alexander Grill, IMEC

  Takamasa Hamai, Kioxia

  Inrok Hwang, SK hynix

  Neeraj Jha, Qualcomm

  Kaustubh Joshi, Intel

  Andreas Martin, Infineon

  Alexandre Subirats, Micron

  Huimei Zhou, IBM

Product Reliability

• Chair: Richard Rao, Marvel

• Vice-Chair: Feng Xia, Intel

• Chair Emeritus: Robert Wu, NXP

  Davide Appello, Technoprobe

  Sandhya Chandrashekhar, Google

  Gabel Chong, Cisco

  Vishal Shah, AMD

  Xinggong Wan, Globalfoundries

  Eric Wang, Nvidia

  Leslie (Yu-Lin) Yang, Mediatek

Reliability Testing

• Chair: Hosain Farr, Qualitau Inc.

• Vice-Chair: Dirk Rudolph, Globalfoundries

• Chair Emeritus: Martina Hommel, Robert Bosch GmbH

  Emmanuel Chery, IMEC

  Amartya Ghosh, Renesas

  Ian Gilbert, Skywater Technology

  Jifa Hao, Google

  Jin Soak Kim, Samsung

  Fiorella Pozzobon, STMicroelectronics

  Yiming Qu, East China Normal University

  Felipe Vallini, Marvell

  Yi Zhao, Zhejiang University

  Aman Kumar, OpenAI

RF / mmW / 5G

• Chair: Hao Yu, IMEC

• Vice-Chair: Gergana Drandova, Qorvo

• Chair Emeritus: Alexis Divay, CEA Leti

  Celestin Doyen, STMicroelectronics

  Peter Ersland, MACOM

  Andreas Jakowetz, Infineon

  Sriram Kalpat, Qualcomm

  Vamsi Putcha, Ampleon

  Vijay Reddy, Texas Instruments

  Purushothaman Srinivasan, Globalfoundries

  Tian-Li Wu, National Yang Ming Chiao Tung University

  Enrico Zanoni, University of Padua

Radiation Effects Reliability

• Chair: Philippe Roche, ST Microelectronics

• Vice-Chair: Yueh (Rick) Chiang, TSMC

• Chair Emeritus: Sang Baeg, Hanyang University

  Jean-Luc Autran, Institute Physics Rennes

  Oscar Balan, NVIDIA US

  Indranil Chatterjee, Airbus

  Christopher Frost, ISIS Neutron and Muon Source

  Rita Fung, Cisco

  Soonyoung Lee, Intel

  Taiki Uemura, Samsung

  Yoni Xiong, Sandia National Laboratory

  Enxia Zhang, University of Central Florida

Silicon Photonics/Co-Packaged Optics

• Chair: Lakshmi Kari, Marvell

• Vice-Chair: Artemisia Tsiara, IMEC

  Seungman Choi, GlobalFoundries

  Cathy Jan, Broadcom

  Kangjie Li, Lightmatter

  Manoj Manjare, Lightwave Logic

  Matteo Meneghini, University of Padova

  Kunal Mukherjee, Stanford University

  Joyce Poon, University of Toronto

  Alexis Samoylov, University of California, Los Angeles
  Quan A. Tran, Intel

• Chair: Nikolaos Papandreou, IBM Research Zurich

• Vice-Chair: Yi-Ching (YC) Ong, TSMC

• Chair Emeritus: David Sunderland, Boeing (retired)

  Timothy Ayles, Airbus
  Ivan Ciofi, IMEC
  Florian Moliere, European Space Agency (ESA)
  Anapathur (Ramesh) Ramesh, Boeing
  Jay Sarkar, Micron
  Manu Shamsa, NVIDIA
  Yong Hyeon Yi, Intel

Transistors

• Chair: Uma Sharma, Micron

• Vice-Chair: Michael Waltl, TU Wien

• Chair Emeritus: Miaomiao Wang, IBM

  Adrian Chasin, IMEC

  Eunae (Grace) Chung, Samsung

  Saptarshi Das, Pennsylvania State University

  Nilesh Goel, BITS Pilani Dubai Campus

  Subhadeep Mukhpadhyay, Intel

  Balaji Narasimham, Broadcom

  Kazuki Nomoto, Sony

  Yunik Son, SK Hynix

  Dhanoop Varghese, Texas Instruments

  Zhuoqing Yu, Huawei HiSilicon

  Lining Zhang, Peking University

  James (Jun-Yu) Huang, TSMC

SiC Devices

• Chair: Ron Green, US Army Research Lab.

• Vice-Chair: Akin Akturk, CoolCAD Electronics

• Chair Emeritus: Patrick Fiorenza, Italian National Research Council

  Thomas Basler, TU Chemnitz

  Alexander Boltnikov, On-Semiconductor

  Daniel Lichtenwalner, Wolfspeed

  Elena Mengotti, ABB Research Center

  Vamsi Mulpuri, Navitas

  Munetaka Noguchi, Mitsubishi Electric

  Jason Ryan, NIST

  Paul Salmen, Infineon

  Alfio Russo, STMicroelectronics