• Packaging and 2.5 / 3D Assembly

• Circuit Reliability and Aging

• Gate / MOL Dielectrics

• Emerging Memory

• ESD and Latchup

• Failure Analysis

• GaN Devices

Packaging and 2.5D/3D Assembly

• Chair: Jyun-Lin Wu, TSMC

• Vice-Chair: Zhi Yang, Groq

• Chair Emeritus: Ravi Aggarwal, Intel

  Chih Chen, National Yang Ming Chiao Tung University (NYCU)

  Nicholas Ginga, The University of Alabama in Huntsville

  Kangwook Lee, SK Hynix

  Chang-Chun Lee, National Tsing Hua University (NTHU)

  Keith Newman, AMD

  Nipun Sinha, Meta

Circuit Reliability and Aging

• Chair: Jeff Gambino, Onsemiconductor

• Vice-Chair: Victor M. van Santen, Technical University of Munich

• Chair Emeritus: Javier Diaz Fortuny, IMEC

  Ricardo Ascazubi, Intel

  Rafael Castro Lopez, IMSE-CNM

  Albert Crespo Yepes, Universitat Autonoma de Barcelona

  Robert Jin, NXP

  Saibal Mukhopadhyay, Georgia Institute of Technology

  Vijay Reddy, Texas Instruments

  Mattia Rossetti, STMicroelectronics

  Christian Schluender, Infineon Technologies AG

  Graham Woods, Synopsys

  Mustafa Berke Yelten, Istanbul Technical University

Gate/MOL Dielectrics

• Chair: Gerhard Rzepa, Global TCAD Solutions

• Vice-Chair: Susanna Reggiani, University of Bologna

• Chair Emeritus: Pei-Jean Liao, TSMC

  Ruben Asanovski, IMEC

  Yu-Kai Chang, TSMC

  Justin Chu, IBM

  Masakazu Goto, Kioxia

  Fei Hui, Zhengzhou University

  Paolo La Torraca, Tyndall National Institute

  Felix Palumbo, Allegro MicroSystems

  Nagarajan Raghavan, Singapore University of Technology and Design

  Suresh Uppal, Rivos

  William Vandendaele, CEA-Leti

  Weiman Yan, University of Illinois at Urbana-Champaign

Emerging Memory

• Chair: Kai Ni, University of Notre Dame

• Vice-Chair: Devanarayanan Ettisserry, Micron

• Chair Emeritus: Jaeyun Yi, SK hynix Inc.

  Davide Fugazza, Intel

  Xiao Gong, National University of Singapore

  Laurent Grenouillet, CEA-Leti

  Keizo Hiraga, Sony

  Tzu-Hsuan Hsu, Macronix

  Hyunsung Jung, Samsung

  Hyungjin Kim, Hanyang university

  Seyoung Kim, POSTECH

  Dutta Sourav, University of Texas at Dallas

  Rina Takashima, Kioxia

ESD and Latchup

• Chair: Mirko Scholz, Infineon Technologies

• Vice-Chair: Mohammed Fakhruddin, Intel

• Chair Emeritus: Mariano Dissegna, Texas Instruments

  Dolphin Abessolo Bidzo, NXP

  Shih-Hung Chen, AMD

  Prantik Mahajan, Renesas Electronics

  Slavica Malobabic, Cirrus Logic

  Mototsugu Okushima, Renesas

  Steven S. Poon, TSMC

  Scott Ruth, AMD

Failure Analysis

• Chair: Hugh Gotts, Air Liquide America

• Vice-Chair: Jesse Guzman, Meta

• Chair Emeritus: Daniel Sullivan, EAG Laboratories

  Sean Beck, Little Fuse

  Jayeshkumar Das, ORS Labs

  Sandeep Rekshi, Intel

  Nataliya Starostina

GaN Devices

• Chair: Matteo Meneghini, University of Padova

• Vice-Chair: Bhawani Shankar, Power Integrations

• Chair Emeritus: Davide Bisi, Transphorm, a Renesas Company

  Matteo Borga, IMEC

  Julien Buckley, CEA Leti

  Okita Hideuki, Panasonic

  Christian Koller, Infineon

  Maurizio Millesimo, University of Bologna

  Rajarshi Roy Chaudhuri, TU Wien

  Brian Rummel, Sandia National Labs

  Valeria Rustichelli, IRT-Saint Exupery

  Kurt Smith, VisIC Technologies

  Tsutomu Uesugi, Nagoya University

  Shuzhen You, Xidian University

  Nicolo Zagni, Universita' di Modena e Reggio Emilia

  Yunwei Ma, Texas Instruments

Memory Reliability

• Chair: Biswajit Ray, Colorado State University

• Vice-Chair: Naoki Yasuda, Kioxia

• Chair Emeritus: Cristian Zambelli, University of Ferrara

  Karine Florent, Micron

  Jaeduk Lee, Samsung

  Nellina Mautone, Infineon

  Gabriele Navarro, CEA-Leti

  Milan Pesic, Applied Materials

  Seong Wan Ryu, SK Hynix

  Pitamber Shukla, Microchip

  Toru Tanzawa, Waseda University

Metallization / BEOL Reliability

• Chair: Ping-Chuan Wang, SUNY New Paltz

• Vice-Chair: Sumy Jose, NXP

• Chair Emeritus: Cher Ming Tan, Chang Gung University

  Arief Budiman, Oregon Institute of Technology

  Seungman Choi, GlobalFoundries

  Andrew Kim, Sandia National Laboratory

  Ming-Hsieh Lin, TSMC

  Stéphane Moreau, CEA-Leti

  Atsushi Ogino, IBM

  Valeriy Sukharev, Siemens EDA

  Olalla Varela Pedreira, IMEC

  Shinji Yokogawa, UEC

  James Zhang, Intel

  Ying-Hong Zhao, Samsung

Neuromorphic Computing Reliability

• Chair: An Chen, IBM

• Vice-Chair: Hiro Akinaga, Hokkaido University

• Chair Emeritus: Gennadi Bersuker, M2D

  Yao-Feng Chang, Onsemi

  Doo Seok Jeong, Hanyang University

  Masaharu Kobayashi, University of Tokyo

  Matthew Marinella, Arizona State University

  Gabriel Molas, Weebit

  Naga Raghavan, Singapore University of Technology and Design

  Sabina Spiga, CNR - IMM

  Stefan Wiefels, PGI Juelich

  Tommaso Zanotti, University of Modena & Reggio Emilia

Process Integration

• Chair: Motoyuki Sato, Tokyo Electron

• Vice-Chair: Rakesh Ranjan, Samsung

• Chair Emeritus: Jean Coignus, CEA Leti

  Eliot Chen, TSMC

  Cheikh Diouf, ST Microelectronics

  Alexander Grill, IMEC

  Takamasa Hamai, Kioxia

  Inrok Hwang, SK hynix

  Kaustubh Joshi, Intel

  Andreas Martin, Infineon

  Hyunchul Sagong, KATECH

  Alexandre Subirats, Micron

  Huimei Zhou, IBM

Product Reliability

• Chair: Robert Wu, NXP

• Vice-Chair: Richard Rao, Marvel

• Chair Emeritus: Yuan Zhang, Amazon

  Jae-Gyung Ahn, AMD

  Davide Appello, Technoprobe

  Paolo Bernardi, Politecnico di Torino

  Sandhya Chandrashekhar, Google

  Gabel Chong, Cisco

  Mihaela (Maria) Tanasescu, AMD

  Xinggong Wan, Globalfoundries

  Eric Wang, Nvidia

  Feng Xia, Intel

  Leslie (Yu-Lin) Yang, Mediatek

Reliability Testing

• Chair: Martina Hommel, Robert Bosch GmbH

• Vice-Chair: Lakshmi Kari

• Chair Emeritus: Fiorella Pozzobon, ST Microelectronics

  Hosain Farr, Qualitau Inc.

  Jifa Hao, Google

  Jin Soak Kim, Samsung

  Yiming Qu, East China Normal University

  Dirk Rudolph, Globalfoundries

  Wangran Wu, Southeast University

  Yi Zhao, Zhejiang University

RF / mmW / 5G

• Chair: Alexis Divay, CEA Leti

• Vice-Chair: Hao Yu, IMEC

• Chair Emeritus: Purushothaman Srinivasan, Globalfoundries

  Michael Dammann, Fraunhofer Institute

  Celestin Doyen, ST Microelectronics

  Gergana Drandova, Qorvo

  Vijay Reddy, Texas Instruments

  Enrico Zanoni, University of Padua

Radiation Effects Reliability

• Chair: Sang Baeg, Hanyang University

• Vice-Chair: Philippe Roche, ST Microelectronics

• Chair Emeritus: Rita Fung, Cisco

  Jean-Luc Autran, Institute Physics Rennes

  Indranil Chatterjee, Airbus

  Li Chen, University of Saskatchewan

  Yueh (Rick) Chiang, TSMC

  Soonyoung Lee, Intel

  Taiki Uemura, Samsung

  Enxia Zhang, University of Central Florida

System Electronics Reliability

• Chair: David Sunderland, Boeing (retired)

• Vice-Chair: Nikolaos Papandreou, IBM Research Zurich

• Chair Emeritus: Florian Moliere, European Space Agency (ESA)

  Timothy Ayles, Airbus

  Ivan Ciofi, IMEC

  Haxel Estavillo, RTX

  Yi-Ching (YC) Ong, TSMC

  Anapathur (Ramesh) Ramesh, Boeing

  Jay Sarkar, Micron

  Manu Shamsa, NVIDIA

Transistors

• Chair: Miaomiao Wang, IBM

• Vice-Chair: Uma Sharma, Micron

• Chair Emeritus: Pragya Shrestha, NIST

  Adrian Chasin, IMEC

  Eunae (Grace) Chung, SamSung

  Nilesh Goel, BITS Pilani Dubai Campus

  Kouta Ibukuro, Sony

  Sriram Kalpat, Qualcomm

  Subhadeep Mukhpadhyay, Intel

  Balaji Narasimham, Broadcom

  Seunghun Son, SK Hynix

  Dhanoop Varghese, Texas Instruments

  Michael Waltl, TU Wien

  Zhuoqing Yu, Huawei HiSilicon

  Lining Zhang, Peking University

SiC Devices

• Chair: Patrick Fiorenza, Italian National Research Council

• Vice-Chair: Ron Green, US Army Research Lab.

• Chair Emeritus: Junji Senzaki, AIST

  Akin Akturk, CoolCAD Electronics

  Mario Alessandrino, STMicroelectronics

  Thomas Basler, TU Chemnitz

  Alexander Boltnikov, On-Semiconductor

  Kiran Chatty, Alpha Omega Semiconductor

  Daniel Lichtenwalner, Wolfspeed

  Elena Mengotti, ABB Research Center

  Paul Salmen, Infineon

  Hiroshi Yano, Tsukuba University