Call for Papers
Inside Call for Papers: Call for Papers/Topics of Interest l Abstract Submission
Abstract submission due October 12, 2026
IRPS 2027 focus topics:
New materials: 2D transition metal dichalcogenides (TMDs), (semi)conducting oxides (IGZO, ITO, IWO, InOx, others), (anti)ferroelectrics, low-k dielectrics, reliability of capacitors, junctions, FETs
Datacenter & AI System Reliability: Emerging trends in Reliability/Availability/Serviceability, silent data errors, reliability at scale, AI & HPC workloads, on -chip telemetry, thermals, optical interconnects
Advanced Memory Reliability: High-capacity and high-bandwidth on-package memory, memory integration, emerging memory reliability, compute in memory
Papers in the Following Areas are Requested
Devices, Materials, Processing, Circuits, Products, and Systems. Specifically:
◼ Circuit Reliability and Aging – Includes digital and analog circuit design for reliability, aging assessments and compact models from circuits to systems; use of EDA tools; radiation and electromagnetic effects on fresh and aged chips, reliability-aware circuit design and monitors.
◼ ESD and Latchup - Component and system-level ESD design, development and characterization, latchup detection, prevention and mitigation. Includes numerical modeling, physics, simulation, troubleshooting and FA .
◼ Failure Analysis – Includes evidence of new failure mechanisms; advances in failure analysis techniques.
◼ Packaging and 2.5D/3D Assembly – Includes chip package interaction; fatigue; power dissipation issues; reliability of 2.5D and 3D IC packaging and integration, interconnects, multichip modules, passive interposers
◼ Product Reliability – Chip-level reliability modeling, DFR, EDA solutions, reliability validation from Pre-Si to Post-Si for SOC, Chiplet, MCM and SIP ; electrical, thermal, mechanical risk and electromagnetic effects.
◼ Radiation Effects Reliability – Includes basic mechanism and impact analysis of radiation effects on components and systems; component, system and application-level modeling, simulation, testing, and mitigation techniques for radiation effects induced reliability issues.
◼ Reliability Testing – Includes reliability test development and design, new methodologies, novel analysis methods and techniques, reliability physics and failure mechanisms, reliability test equipment, tools, and test structures.
◼ RF/mmW/5G – RF reliability test and modeling of CMOS, BiCMOS , SiGe, GaN, III -V devices and circuits for GHz/THz RF and high-speed switch applications. Reliability of novel materials and devices for RF/mmW/5G and beyond. DC/AC/RF reliability correlation.
◼ System Electronics Reliability – Reliability of electronic systems used in consumer electronics, data centers, health care, space, automotive, etc.; architecture, design, modeling, telemetry, electromagnetic effects, and largescale analysis techniques such as machine & deep learning
◼ Emerging Memory – Novel memory devices based on magnetics (e.g., STT, SOT, VCMA), or resistive (selector or memory element) RAM, ferroelectrics, or phase change memory for eNVM or stand-alone applications.
◼ GaN Devices and SiC Devices – Threshold voltage instabilities, charge trapping, switching stress, breakdown, impact of crystalline defects, radiation effects, other reliability topics including thermal issues in power devices.
◼ Dielectrics Reliability – Includes defects in dielectrics and at their interfaces, dielectric breakdown, BTI, and leakage. Covers studies across all applications (FETs, capacitors, MOL, etc.) provided the focus is directly on dielectric degradation mechanisms.
◼ Memory Reliability – Includes stand -alone volatile memories (SRAM, DRAM), planar and 3D NAND Flash memories, embedded memories (stand -alone and on- chip) and SSDs .
◼ Metallization/BEOL Reliability – Includes electromigration; Joule heating; stress migration; low-k dielectric breakdown.
◼ Neuromorphic Computing Reliability – Assessment of operational stability, variability, and degradation across devices and co-packaged systems enabling neuromorphic, AI, and emerging computing applications, and their impact on circuit, system ,and algorithm-level performance.
◼ Process Integration – Includes manufacturing process such as PID/charging, anneals/implants, impact on component reliability, existing and new process-related reliability issues in production; foundry reliability challenges.
◼ Transistors – Includes hot carrier phenomena; BTI ; RTN ; advanced node scaling; variability; Ge and III -V channels; nano-wire, gate all-around, nano-ribbon, fork-sheet devices.
◼ Silicon Photonics/Co -Packaged Optics (CPO) – Intrinsic reliability challenges of silicon photonics devices and materials, laser and light engine reliability, multi-physics failure analysis, fiber attach and optical interface reliability in CPO, reliability and standardization gaps for CPO .