Invited Speakers
Inside Program: Conference Program l Keynote Speakers l Tutorials
Workshops l Year in Review l Highlighted Papers | Invited Speakers
Invited Speakers
| Topic | Speaker | Title |
|---|---|---|
| GaN Devices | Tetsuo Narita (Toyotas) | Design Principles of Metal-Oxide-Semiconductor Structures for Vertical GaN Power Devices |
| Memory Reliability | Tomoya Sanuki (Kioxia) | Reliability of 3D Flash Memory Under Cryogenic Operation for Bit Cost Scaling and Long-term Usage |
| Packaging and 2.5/3D Assembly | Tz-Cheng Chiu (National Cheng Kung University) | Effect of inelasticity on the cracking of materials and interfaces in heterogeneous integration |
| Packaging and 2.5/3D Assembly | Stefaan Van Huylenbroeck (imec) | Wafer to Wafer hybrid bonding pitch scaling challenges |
| Radiation Effect Reliability | Chang Goo Kang (Korea Atomic Energy Research Institute) | Correlation Between Interface Engineering and Radiation Hardness of Nanoscale Devices |
| SiC Devices | Filippo Giannazzo (CNR-IMM) | Two-dimensional Materials and Wide Bandgap Semiconductors: integration challenges and novel device applications |