The Submission deadline is January 19th.

YOUR ORIGINAL PAPERS AND POSTERS ARE SOLICITED, which:

• Identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems;

• Identify how fabrication processes influence the susceptibility of product to particular physical failure mechanisms;

• Quantify the impact of device and circuit design, as well as material and process selection on reliability;

• Present new, innovative, or improved failure analysis techniques;

• Describe reliability testing/stressing, qualification, and screening methodologies or strategies for materials, devices, circuits, or chips; either at wafer- or module-level for commercial or “extreme” environments;

• Demonstrate techniques to build-in or extend reliability while meeting performance goals, especially as technologies are scaled.

Questions?

• All questions or inquiries for further information regarding this meeting should be directed to t.holle@ieee.org