Abstract submission due: Oct. 22, 2022
The IRPS 2023 virtual conference content will remain available to registered attendees through April 30th, 2024, via MAIN CONFERENCE link, and TUTORIALS & YIR link. Register to access the video and slide of:
2023 MAIN CONFERENCE
4 Keynote
Ann Kelleher, EVP and GM of Technology Development, Intel
Gary Hicok SVP, NVIDIA
Mark Fuselier, SVP, Technology & Product Engineering, AMD
Rohit Vidwans, EVP and Chief Engineering & Manufacturing Officer, Ampere
111 Oral presentation
81 Poster presentation
2023 TUTORIAL
3 Year-in-review
Soft Error in Planar, FDSOI, FinFET, and GAA by Taiki Uemura (Samsung Electronics)
SiC Devices by Daniel J. Lichtenwalner (Wolfspeed, A Cree Company)
FEOL reliability of fin, NW, NS FETs by Stanislav Tyaginov, Michiel Vandemaele, Erik Bury (imec)
28 Tutorial
2023 Corporate Patrons
Gold Patrons
Event Patrons
Exhibitor Lunch Patron
Registration Gift Patron
Bronze Patrons
Co-Sponsored by
About IRPS
For 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world…