Invited Speakers
Inside Program: Conference Program l Keynote Speakers l Tutorials
Workshops l Year in Review l Highlighted Papers | Invited Speakers
Invited Speakers
| Topic | Speaker | Title |
|---|---|---|
| Circuit Reliability and Aging | Rafael Castro Lopez (IMSE-CNM - Seville Institute of Microelectronics) | When variability meets security |
| Emerging Memory | Yoonjong Song (Samsung) | Reliability Challenges in advanced STT-MRAM |
| Failure Analysis | Susan Li (Marvell) | Failure Analysis Challenges on Chip Scale Packages |
| GaN Devices | Roy King-Yuen Wong (The National Tsing Hua University) | GaN power device & ICs reliability and/or GaN-based power converters reliability |
| GaN Devices | Kamal Varadarajan (Power Integration) | 1200-V GaN reliability and/or system-in-package GaN reliability |
| Gate/MOL Dielectrics | Stephan Menzel (Peter Grünberg Institute) | Dielectric breakdown from RRAM forming process |
| Gate/MOL Dielectrics | Tuo-Hung Hou (NYCU/TSRI) | Reliability in Ferroelectric films or oxide semiconductor |
| Memory Reliability | Milan Pesic (Applied Materials) | 3D NAND Flash Device-level reliability |
| Metallization/BEOL Reliability | Ehrenfried Zschech (ma lab) | High-resolution X-ray imaging of controlled microcrack steering in BEoL stacks |
| Metallization/BEOL Reliability | Hajdin Ceric (Vienna University of Technology) | Electromigration in Gold: Challenges and Possibilities |
| Neuromorphic Computing Reliability | Wenhao Song (Univ. Southern California) | Improving reliability of analog computing using memristors by increasing precision at both device and system levels |
| Packaging and 2.5/3D Assembly | Chih Chen (National Yang Ming Chiao Tung University) | Thermo-mechanical stress and its effect on the reliability of Cu-SiO2 hybrid bonds for 3D IC heterogeneous integration |
| Packaging and 2.5/3D Assembly | Qiming Zhang (Exponent) | Design Considerations of Long-Term Reliability for Outdoor Electronic Assemblies |
| Product Reliability | Y. L. Yang (Mediatek) | Enhancing Automotive Product Quality Through the Machine Learning-Based Methodology |
| Process Integration | Yan Li (Samsung) | A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages |
| Radiation Effect Reliability | Prasun Raha (Rivian) | (Tentative) Safety in Memory Architectures for Automotive Applications |
| Reliability Testing | Riccardo Villa (ST Microelectronics) | A Comprehensive Reliability Approach to Heterogeneous Integration in Power Packaging |
| RF/mmW/5G | Jeffrey LaRoche (Raytheon) | III-V GaN Reliability |
| SiC Devices | Munetaka Noguchi (Mitsubishi Electric) | Gate oxdie instability of SiC MOSFET |
| SiC Devices | Andrea Severino (ST Microelectronics) | TBA |
| System Electronics Reliability | Stephanie Bourbouse (ESA) | Modelling predictive reliability of Systems embedding EEE parts : FIDES method for Space applications |
| Transistors | Mikael Casse (CEA-LETI) | Challenges in scaling quantum computers and the critical role of understanding device physics and reliability at low temperatures |