Invited Papers
Inside Program: Conference Program l Keynote Speakers l Tutorials
Workshops l Year in Review l Highlighted Paper l Invited paper
March 28th (Tue)
| Topic | Speaker | Title |
|---|---|---|
| Gate/MOL Dielectrics | Michiel Vandemaele (imec) | (2A.1) Investigating Nanowire, Nanosheet and Forksheet FET Hot Carrier Reliability via TCAD Simulations |
| Neuromorphic Computing Reliability | Martin Frank (IBM Research) | (2B.1) Impact of Phase-Change Memory Drift on Energy Efficiency and Accuracy of Analog Compute-in-Memory Deep Learning Inference |
| Neuromorphic Computing Reliability | Ken Takeuchi (University of Tokyo) | (2B.3) Neuromorphic Computation-in-Memory System |
| GaN Power Device | Tetsu Narita (Toyota Central Labs) | (2C.1) Reliability issues of gate oxides and p-n junctions for vertical GaN metal-oxide-semiconductor field-effect transistors |
| Memory Reliability | Daniel Worledge (IBM) | (3A.1) Advances in Spin-Transfer-Torque MRAM |
| Emerging Memory | Marek Skowronski (Carnegie Mellon University) | (4A.1) Material instabilities in the TaOx-based resistive switching devices |
| Circuit Reliability and Aging | Javier Martin-Martinez (Universitat Autonoma de Barcelona) |
(4B.1) Challenges and solutions to the defect-centric modeling and circuit simulation of time dependent variability |
| Gate/MOL Dielectrics | Rahim Kasim (Intel) | (4C.1) Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes |
March 29th (Wed)
| Topic | Speaker | Title |
|---|---|---|
| Process Integration | Sung Mock Ha (Samsung) | (5B.1) Comprehensive Reliability Characterization on Multi-stacked CMOS Logic and Memory chip featuring high-k & metal gate process |
| System Electronics Reliability | Jason Jopling (Intel) | (5C.1) Risk Management Informed by an Uncertain Bathtub Curve |
| Packaging and 2.5/3D Assembly | Ryan (Yinlung) Lu (TSMC) | (6B.2) Reliability challenges from 2.5D to 3DIC in advanced package development |
| Reliability Testing | William Vandendaele (CEA LETI) | (7B.1) Reliability of GaN MOS-c HEMTs: From TDDB to Threshold Voltage Instabilities |
| Transistors | Erik Bury (imec) | (8A.3) Reliability Challenges in Forksheet Devices |
| Failure Analysis | Brendan Foran (Aerospace Corporation) | (8B.2) Assessing Advanced CMOS Structural Variability Quantification using Microscopy |
| RF/mmW/5G | Anirban Bandyopadhyay (GlobalFoundries) | (8C.1) Differentiated Silicon technologies for mmwave 5G and 6G applications |
March 30th (Thu)
| Topic | Speaker | Title |
|---|---|---|
| Radiation Effect Reliability | Jeffrey Prinzie (KU Leuven) | (9B.1) Soft Error Resilience in Frequency Synthesizers: From analog PLLs to all-digital Synthesizers |
| Neuromorphic Computing Reliability | Laurent Grenouillet (CEA LETI) | (10B.1) Reliability assessment of hafnia-based ferroelectric devices and arrays for memory and AI applications |
| Neuromorphic Computing Reliability | Jianshi Tang (Tsinghua University) | (10B.3) Reliability of Memristive Devices for High-Performance Neuromorphic Computing |
| Memory Reliability | Kishore Kumar Muchherla (Micron Technology Inc.) | (10C.1) Reliability of 3D NAND Flash for Future Storage Systems |
| Wide-Bandgap Semiconductors (SiC) | Elena Mengotti (ABB Switzerland Ltd) | (11A.1) Industrial approach to the chip and package Reliability of SiC MOSFETs and diodes |
| Metallization/BEOL Reliability | Melina Lofrano (imec) | (11B.1) Towards accurate temperature prediction in BEOL for reliability assessment |
| Product Reliability | Brendan Foran (Aerospace Corporation) | (11C.1) Excellent Radio Front-end Receiver reliability of BLE SoC under RF-HTOL Stress Test |
| RF/mmW/5G | Kevin Huang (Nordic semiconductor ASA) | (8C.1) Differentiated Silicon technologies for mmwave 5G and 6G applications |