Circuit Reliability / Aging
Emerging Memory Reliability
ESD / Latchup
Failure Analysis
GaN Devices
Gate / MOL Dielectrics

Packaging and 2.5D/3D Assembly

• Chair: Keith Newman, AMD

• Vice-Chair: Ravi Aggarwal, intel

• Chair Emeritus: Mohammad Enamul Kabir, intel

Circuit Reliability and Aging

• Chair: Kanad Basu, University of Texas at Dallas

• Vice-Chair: Javier Diaz Fortuny, imec

• Chair Emeritus: Xiankun "Robert" Jin, NXP Semiconductor

Gate/MOL Dielectrics

• Chair: Zakariae Chbili, intel

• Vice-Chair: P.J. Liao, TSMC

• Chair Emeritus: Stanislav Tyaginov, imec

Emerging Memory

• Chair: Carlo Cagli, ST Microelectronics

• Vice-Chair: Joe McCrate, Micron

• Chair Emeritus: SangBum Kim, Seoul National University

ESD and Latchup

• This committee consists of IEW and IRPS

  IEW

• Chair: Michael (Misha) Khazhinsky, Silicon Labs

• Vice-Chair: Ann Concannon, Texas Instruments

• Chair Emeritus: Gianluca Boselli, Texas Instruments

  IRPS

• Chair: Lorenzo Cerati, ST Microelectronics

• Vice-Chair: Mariano Dissegna, Texas Instruments

• Chair Emeritus: Nathaniel Peachey, Qorvo

Failure Analysis

• Chair: Jayhoon Chung, Texas Instruments

• Vice-Chair: TBD

• Chair Emeritus: Michael Gribelyuk, Western Digital

GaN Devices

• Chair: Andrew Binder, Sandia National Lab

• Vice-Chair: Davide Bisi, Transphorm Inc.

• Chair Emeritus: Srabanti Chowdhury, Stanford University

Memory Reliability

• Chair: Andrea Chimenton, Intel

• Vice-Chair: Cristian Zambelli, University of Ferrara

• Chair Emeritus: Yuichiro Mitani, Tokyo City University

  —

Metallization / BEOL Reliability

• Chair: Baozhen Li, IBM

• Vice-Chair: Seungman Choi, GlobalFoundries

• Chair Emeritus: Andrew Kim, Texas Instruments

Neuromorphic Computing Reliability

• Chair: Bin Gao, Tsinghua University

• Vice-Chair: Yao-Feng Chang, intel

• Chair Emeritus: Stefano Ambrogio, IBM

Process Integration

• Chair: Purushothaman Srinivasan, Global Foundries

• Vice-Chair: Jean Coignus, CEA Leti

• Chair Emeritus: Purushothaman Srinivasan, Global Foundries

Product Reliability

• Chair: Feng Xia, Intel

• Vice-Chair: Yuan Zhang, Amazon

• Chair Emeritus: Ming-Han (Hank) Hsieh, MediaTek

Reliability Testing

• Chair: Jifa Hao, Google

• Vice-Chair: Hosain Farr, Qualitau Inc.

• Chair Emeritus: Samia A. Suliman, The Pennsylvania State University

RF / mmW / 5G

• Chair: Sriram Kalpat, Qualcomm

• Vice-Chair: Purushothaman Srinivasan, Global foundries

• Chair Emeritus: Don Gajewski, Cree/Wolfspeed

Radiation Effect Reliability (Soft Errors)

• Chair: Chundong Liang, Amazon AWS

• Vice-Chair: Rita Fung, Cisco

• Chair Emeritus: Haibin Wang, Hohai University

System Electronics Reliability

• Chair: Phil Joseph Oldiges, Sandia

• Vice-Chair: Florian Moliere, European Space Agency - ESA

• Chair Emeritus: Kok Yiang, Amazon Lab126

Transistors

• Chair: Eunae (Grace) Chung, Samsung

• Vice-Chair: Pragya Shrestha, NIST

• Chair Emeritus: Runsheng Wang, Peking University

SiC Devices

• Chair: Ulrike Grossner, ETH Zurich

• Vice-Chair: Junji Senzaki, AIST

• Chair Emeritus: Peter Losee, United SiC