Committees
2022 IRPS Technical Committees
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2.5 / 3D Advanced Packaging
Chair Preeti Chauhan, Google
Vice-Chair Kabir Enamul, Intel
| CS Premachandran | Ravi Aggarwal, Intel |
| Emmanuel Chery, imec | YC Chuang, TSMC |
| Enamul Kabir, Intel | Kangwook Lee, SK Hynix |
| John Osenbach, Infinera | Ashok Pachamuthu, Western Digital Corporation |
| Kanika Sethi, Intel | Guotao Wang, Apple |
| Gang Yuan, Microsoft |
Circuit Reliability / Aging
Chair Kazutoshi Kobayashi, Kyoto Institute of Technology
Vice-Chair Robert Jin, NXP
| Florian Cacho | Kanad Basu, University of Texas at Dallas |
| Alain Bravaix, ISEN | Jeff Gambino, ON Semiconductor |
| Vijay Reddy, TI | Saibal Mukhopadhyay, Georgia Institute of Technology |
| Mehdi Sadi, Auburn University | Hyewon Shim, Samsung |
| Pieter Weckx, imec |
Gate / MOL Dielectrics
Chair Andrea Padovani, AMAT
Vice-Chair Stanislav Tyaginov, imec
| Zakariae Chbili, Intel | Francesco Maria Puglisi, Università di Modena e Reggio Emilia |
| Masakazu Goto, Kioxia | Fei Hui, Technion |
| Pei Jean Liao, TSMC | Zhigang Ji, Shangai Jiatong University |
| Hideki Minari, Sony | James Palmer, Intel |
| Felix Palumbo, Conicet | Nagarajan Raghavan, Singapore University of Technology & Design |
| Gerhard Rzepa, Global TCAD | Susanna Reggiani, University of Bologna |
| Chen Wu, imec | Maria Toledano Luque, GlobalFoundries |
Emerging Memory Reliability
Chair Barry O’Sullivan, imec
Vice-Chair SangBum Kim, Seoul National University
| Carlo Cagli, CEA | Shimeng Yu, George Institute of Technology |
| Yusuke Higashi, Kioxia | Keizo Hiraga, Sony |
| Guohan Hu, IBM | Junghyuk Lee, Samsung |
| Joe McCrate, Micron | Kai Ni, Rochester Institute of Technology |
| Kiran Pangal, Intel | Jaeyun Yi, SK Hynix |
| Tetsuo Endo, Tohoku University |
ESD / Latchup
Chair Michael Stockinger, NXP
Vice-Chair Nathaniel Peachey, Qorvo
| Mototsugu Okushima, Renesas | Kuo-Ji Chen, TSMC |
| Nathan Jack, Intel | Han-gu Kim, Samsun |
| Scott Ruth, AMD | Mirko Scholz, Infineon Technologies |
| Teruo Suzuki, Socionext |
Failure Analysis
Chair Eckhard Langer, GlobalFoundries
Vice-Chair Bryan Tracy, Tesla
| Jayhoon Chung, TI | Brendan Foran, The Aerospace Corporation |
| Jane Li, Nvidia | Michael Gribelyuk, Western Digital Corporation |
| Dirk Rudolph, GlobalFoundries | Moritz Andreas Meyer, GlobalFoundries |
| Hyuncheol (Caleb) Shin, Intel |
GaN Power Devices
Chair Kaustubh Joshi, Intel
Vice-Chair Srabanti Chowdhury, Stanford University
| Sameh Khalil, Infineon | Andrew Binder, Sandia National Lab |
| Julien Buckley, CEA/LETI | Michael Uren, University of Bristol |
| Okita Hideuki, Panasonic | Matteo Meneghini, University of Padova |
| Clemens Ostermaier, Infineon | Randy Tompkins, US Army Research Lab |
| Shuzhen You, imec | Tsutomu Uesugi, Nagoya University of Japan |
| Kevin J Chen, HKUST | Shireen Warnock, MIT Lincoln Laboratory |
Memory
Chair Shu-jen Lee, Intel
Vice-Chair Yuichiro Mitani, Tokyo City University
| Jiezhi Chen, Shandong Univ. | Ming-Yi Lee, Macronix |
| Jin Lyu, YMTC | Jeong-Hoon Oh, Samsung |
| Seong-wan Ryu, SK Hynix | Zhiqiang Su, MemInsights Technology |
| Georg Tempel, Infineo | Ken Takeuchi, The University of Tokyo |
| Yuri Tkachev, microchip | Cristian Zambelli, University of Ferrara |
| Naoki Yasuda, Kioxia |
Metallization / BEOL Reliability
Chair Ming-Hsien Lin, TSMC
Vice-Chair Andrew Kim, Texas Instruments
| Rahim Kasim, Intel | Seungman Choic, GlobalFoundries |
| Kristof Croes, imec | Gavin Hall, Infineon |
| Matsuyama Hideya, Socionext | Ki-Don Lee, Samsung |
| Baozhen Li, IBM | Valeriy Sukharev, Mentor Graphics |
| Shinji Yokogawa, Univ. E. C | Cher Ming Tan, Chang Gung Univ. |
Neuromorphic Reliability
Chair Tuo-Hung Hou, National Chiao Tung University
Vice-Chair Stefano Ambrogio, IBM
| Yao-Feng Chang, Intel | Kin Leong Pey, Singapore University of Technology & Design |
| An Chen, IBM | Hiro Akinaga, National Institute of AIST |
| Arthur Edwards, AFRL/RVSV | Gennadi Bersuker, Aerospace Corporation |
| Bin Gao, Tsinghua University | Rainer Waser, RWTH Aachen Univ. |
| Gabriel Molas, CEA Leti | Matthew Marinella, Sandia Laboratory |
| Sabina Spiga, CNR | John Paul Strachan, Jülich Research Centre |
| Doo Seok Jeong, Hanyang Univ. | Eric Vogel, George Institute of Technology |
Process Integration
Chair Guido Sasse, NXP
Vice-Chair Purushothaman Srinivasan, GlobalFoundries
| Anisur Rahman, Intel | Lincoln Busselle, Broadcom |
| Jean Coignus, CEA Leti | Xavier Federspiel, ST |
| Alexander Grill, imec | Jen-Hao Lee, TSMC |
| Hiroshi Miki, Hitachi | Mustapha Rafik, Aledia |
| Rakesh Ranjan, Samsung | Hyunchul Sagong, KATECH |
| Motoyuki Sato, Tokyo Electron | Richard G Southwick, IBM |
Product Reliability
Chair Sandhya Chandrashekhar, Google
Vice-Chair Ming-Han (Hank) Hsieh, MediaTek
| Richard (Shiguo) Rao, Marvell | Davide Appello, ST Microelectronics |
| Lakshmi Kari, Qualcomm | Paolo Bernardi, Politecnico di Torino |
| Feng Xia, Intel | Mihaela (Maria) Tanasescu, AMD |
| Xinggong Wan, GlobalFoundries |
Reliability Testing
Chair Yi Zhao, Zhejiang University
Vice-Chair Samia A. Suliman, The Pennsylvania State University
| Saptarshi Das, Penn State | Osama O. Awadelkarim, Penn State |
| Hosain Farr, Qualitau Inc. | Linfei (Jamie) Li, MediaTek Inc. |
| Kevin Manning, Analog Devices | Stephane Moreau, CEA Leti |
| Dirk Rudolph, GlobalFoundries | Fiorella Pozzobon, ST Microelectronics |
| Derek Slottke, Intel | Yiming Qu, East China Normal University |
| Yangjun Feng, Canoo Inc. | Wangran Wu, Southeast University |
| Jifa Hao, ON Semiconductor |
RF / mmW / 5G Reliability
Chair Fernando Guarin, GlobalFoundries
Vice-Chair Don Gajewski, CREE/Wolfspeed
| Jose Jimenez, Qorvo | Karim Boutros, Boeing |
| Chris Bozada, AFRL | Nadine Collaert, imec |
| Sriram Kalpat, Qualcomm | Michael Dammann, Fraunhofer Institute |
| Farid Medjdoub, CNRS | Nathalie Malbert, University of Bordeaux |
| Vijay Reddy, TI | Rosana Rodriguez, Universitat Autonoma de Barcelona |
| Enrico Zanoni, Univ. of Padova | Purushothaman Srinivasan, GlobalFoundries |
Soft Error
Chair Paula Chen, XILINX
Vice-Chair Haibin Wang, Hohai University
| Daisuke Kobayashi, ISAS/JAXA | Laurent Artola, ONERA |
| Yi-Pin Fang, TSMC | Gilles Gasiot, ST Microelectronics |
| Nelson Gaspard, NASA | Simone Gerardin, University of Padova |
| Jin-woo Han, NASA | Masanora Hashimoto, Kyoto University |
| Chundong Liang, Micron | Balaji Narasimham, Broadcom |
| Taiki Uemura, Samsung | Ygor Aguiar, CERN |
System Electronics Reliability
Chair Yan Liu, Medtronic
Vice-Chair Nassibe Rahimi, NVIDIA
| Flavio Griggio, Microsoft | Jyotika Athavale, NVIDIA |
| Rob Kwasnick, Intel | Florian Moliere, Airbus |
| Yi-Ching (YC) Ong, TSMC | Phil Oldiges, Sandia National Laboratory |
| Rich Pietri, Apple | Nikolaos Papandreou, IBM Research Zurich |
| Jay Sarkar, Micron | David Sunderland, Boeing (retired) |
| Kok Yiang, Amazon Lab126 |
Transistors
Chair Bonnie Weir, Broadcom
Vice-Chair Runsheng Wang, Peking University
| Chetan Prasad, Intel | Alain Bravaix, IM2NP (ST Micro) |
| Adrian Chasin, imec | Eunae (Grace) Chung, Samsun |
| Tibor Grasser, TUWien | Nilesh Goel, BITS Pilani Dubai Campus |
| Chris Changze Liu, Huawei | Wen Liu, GlobalFoundries |
| Uma Sharma, Micro | Montserrat Nafria, Universitat Autonoma de Barcelona |
| Pragya Shrestha, NIST | Kazuki Nomoto, Sony Semiconductor Solutions |
| Seunghun Son, SK Hynix | Miaomiao Wang, IBM |
| Nuo Xu, TSMC |
Wide-Bandgap Semiconductors - SiC
Chair Daniel Lichtenwalner, Wolfspeed
Vice-Chair Fernando Guarin, GlobalFoundries
| Thomas Aichinger, Infineon | Anant Agarwal, The Ohio State University |
| Thomas Basler, TU Chemnitz | Akin Akturk, CoolCAD Electronics |
| Charles Cheung, NIST | Alexander Boltnikov, ON Semiconductor |
| Ulrike Grossner, ETH Zuric | Patrick Fiorenza, Italian National Research Council |
| Junji Senzaki, AIST | Ron Green, US Army Research Lab |
| Heiji Watanabe, Osaka University |