
Late News Papers
Inside Call for Papers: Call for Papers/Topics of Interest l Abstract Submission l Late News Papers
Submission of late paper manuscripts is now closed.
Full-length manuscripts with late breaking news may be considered for inclusion in the conference/proceedings.
Authors are asked to submit late news papers announcing only very recent developments. Papers must be full-length manuscripts, ready for publication.
To submit your late paper, full manuscript, follow these instructions:
Read all of this page to ensure you understand the process.
The instructions that were used for regular abstracts will be the same for Late News submissions. However, Late News papers MUST submit a full manuscript (6-10 page paper), NOT a two-page abstract. Further details can be found HERE.
Create your full paper manuscript using the template found HERE.
Save or convert the Word document to PDF format via IEEE PDF eXpress™. Further details can be found HERE.
Submit your Late News manuscript PDF by clicking HERE.
Full manuscripts are due by 11:59 PM CST on January 23, 2022. All papers must be submitted electronically. Only pdf file format can be accepted. The work described in your paper must be original and complete. The paper should highlight the novelty of the work and place it in the context of previous works.
Notification of acceptance in the conference will be sent out on February 7, 2022.
YOUR ORIGINAL PAPERS AND POSTERS ARE SOLICITED, which:
Identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems;
Identify how fabrication processes influence the susceptibility of product to particular physical failure mechanisms;
Quantify the impact of device and circuit design, as well as material and process selection on reliability;
Present new, innovative, or improved failure analysis techniques;
Describe reliability testing/stressing, qualification, and screening methodologies or strategies for materials, devices, circuits, or chips; either at wafer- or module-level for commercial or “extreme” environments;
Demonstrate techniques to build-in or extend reliability while meeting performance goals, especially as technologies are scaled.
Questions?
All questions or inquiries for further information regarding this meeting should be directed to t.holle@ieee.org